HMC874LC3C v07.0616 20 Gbps CLOCKED COMPARATOROutline Drawing T M S - S R O AT R A P OM C NOTES: 1. PACKAGE BODY MATERIAL: ALUMINA 2. LEAD AND GROUND PADDLE PLATING: 30-80 MICROINCHES GOLD OVER 50 MICROINCHES MINIMUM NICKEL. 3. DIMENSIONS ARE IN INCHES [MILLIMETERS]. 4. LEAD SPACING TOLERANCE IS NON-CUMULATIVE. 5. PACKAGE WARP SHALL NOT EXCEED 0.05mm DATUM -C- 6. ALL GROUND LEADS MUST BE SOLDERED TO PCB RF GROUND. 7. PADDLE MUST NOT BE DC GND. THERMAL DISSIPATION PATH ONLY. Package Information Part Number Package Body Material Lead Finish MSL Rating Package Marking [2] HMC874LC3C Alumina, White Gold over Nickel MSL3 [1] H874 XXXX [1] Max peak reflow temperature of 260°C [2] 4-Digit lot number XXXX For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 781-329-4700 • Order online at www.analog.com 7 Application Support: Phone: 1-800-ANALOG-D Document Outline Typical Applications Features Functional Diagram General Description Electrical Specifications Performance Characteristics Outline Drawing Package Information Evaluation PCB CLK, CLK Interfacing Resistor Network Bias Tee
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