Datasheet ADP165, ADP166 (Analog Devices) - 7

Data Sheet ADP165/ADP166 VOUT 1 6 VIN ADP165/ NC 2 ADP166 5 NC TOP VIEW (Not to Scale) GND 3 4 EN NOTES 1. NC = NO CONNECT. NOT CONNECTED INTERNALLY. 2. THE EXPOSED PAD MUST BE CONNECTED TO
006
GROUND. THE EXPOSED PAD ENHANCES THE THERMAL PERFORMANCE OF THE PACKAGE.
12188- Figure 6. 6-Lead LFCSP, Fixed Output Pin Configuration
Table 7. Fixed Output, 6-Lead LFCSP Pin Function Descriptions Pin No. Mnemonic Description
1 VOUT Regulated Output Voltage. Bypass VOUT to GND with a 1 µF or greater capacitor. 2 NC No Connect. This pin is not connected internally. 3 GND Ground. 4 EN Enable Input. Drive EN high to turn on the regulator; drive EN low to turn off the regulator. For automatic startup, connect EN to VIN. 5 NC No Connect. This pin is not connected internally. Connect this pin to GND or leave open. 6 VIN Regulator Input Supply. Bypass VIN to GND with a 1 µF or greater capacitor. EPAD Exposed Pad. The exposed pad must be connected to ground. The exposed pad enhances the thermal performance of the package.
VOUT 1 6 VIN ADP165/ ADJ 2 ADP166 5 NC TOP VIEW (Not to Scale) GND 3 4 EN NOTES 1. NC = NO CONNECT. NOT CONNECTED INTERNALLY. 2. THE EXPOSED PAD MUST BE CONNECTED TO
007
GROUND. THE EXPOSED PAD ENHANCES THE THERMAL PERFORMANCE OF THE PACKAGE.
12188- Figure 7. 6-Lead LFCSP, Adjustable Output Pin Configuration
Table 8. Adjustable Output, 6-Lead LFCSP Pin Function Descriptions Pin No. Mnemonic Description
1 VOUT Regulated Output Voltage. Bypass VOUT to GND with a 1 µF or greater capacitor. 2 ADJ Output Voltage Adjust Pin. Connect the midpoint of the voltage divider between VOUT and GND to this pin to set the output voltage. 3 GND Ground. 4 EN Enable Input. Drive EN high to turn on the regulator; drive EN low to turn off the regulator. For automatic startup, connect EN to VIN. 5 NC No Connect. This pin is not connected internally. 6 VIN Regulator Input Supply. Bypass VIN to GND with a 1 µF or greater capacitor. EPAD Exposed Pad. The exposed pad must be connected to ground. The exposed pad enhances the thermal performance of the package. Rev. A | Page 7 of 23 Document Outline FEATURES APPLICATIONS TYPICAL APPLICATION CIRCUITS GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS RECOMMENDED SPECIFICATIONS: INPUT AND OUTPUT CAPACITORS ABSOLUTE MAXIMUM RATINGS THERMAL DATA THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION CAPACITOR SELECTION Output Capacitor, COUT Input Bypass Capacitor, CIN Input and Output Capacitor Properties ENABLE FEATURE UNDERVOLTAGE LOCKOUT (UVLO) CURRENT-LIMIT AND THERMAL OVERLOAD PROTECTION THERMAL CONSIDERATIONS PCB LAYOUT CONSIDERATIONS LIGHT SENSITIVITY OF WLCSPs OUTLINE DIMENSIONS ORDERING GUIDE