Datasheet ADM7172-KGD (Analog Devices) - 7

Known Good Die ADM7172-KGD OUTLINE DIMENSIONS 0.2032 1.020 1A 8C 1B 8B 1C 8A 2A 7C 1.940 2B 7B 2C 7A 6B 3 6A 4 5 A TOP VIEW SIDE VIEW 2015- (CIRCUIT SIDE) 0.070 × 0.070 21- 08-
Figure 2. 8-Pad Bare Die [CHIP] (C-8-5) Dimensions shown in millimeters
DIE SPECIFICATIONS AND ASSEMBLY RECOMMENDATIONS Table 5. Die Specifications Parameter Value Unit
Die Size (Maximum) 1020 × 1940 µm Bond Pad (Minimum) 70 × 70 µm Thickness 203.2 µm Scribe Line Width 80 µm Bond Pad Composition AlCu (0.5%) % Passivation Type Nitride Not applicable Backside Bias GND Not applicable
Table 6. Assembly Recommendations Assembly Component Recommendation
Die Attach Ablestik 8290 Bonding Method 1.2 mil gold
ORDERING GUIDE Model Output Voltage (V) Temperature Range Package Description Package Option
ADM7172-4.2-KGD-WP 4.2 −40°C to +125°C 8-Pad Bare Die [CHIP] C-8-5
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Rev. A | Page 7 of 7 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION REVISION HISTORY SPECIFICATIONS INPUT AND OUTPUT CAPACITOR, RECOMMENDED SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS OUTLINE DIMENSIONS DIE SPECIFICATIONS AND ASSEMBLY RECOMMENDATIONS ORDERING GUIDE