Datasheet HMC976LP3E (Analog Devices) - 5

HMC976LP3E
v02.1112
400mA LOW NOISE, HIGH PSRR LINEAR VOLTAGE REGULATOR Table 2. Absolute Maximum Ratings
Vdd to GND Voltage +5.8V / -0.3V Stresses above those listed under Absolute Maximum EN to GND Voltage +5.8V /-0.3V Ratings may cause permanent damage to the device. This RDx / HVx to GND Voltage +5.8V / -0.3V is a stress rating only; functional operation of the device at these or any other conditions above those indicated in Maximum Dissipation 780mW the operational section of this specification is not implied. Thermal Resistance 51.5 °C/W [3] Exposure to absolute maximum rating conditions for (Junction to Ambient) extended periods may affect device reliability. The absolute Thermal Resistance (Junction to 18 °C/W maximum ratings apply individually only, not in combination. Case, Ground Paddle) Maximum Junction Temperature +150 °C Max Output Current 420 mA Storage Temperature -65 to +150 °C ELECTROSTATIC SENSITIVE DEVICE ESD Sensitivity (HBM) Class 1C OBSERVE HANDLING PRECAUTIONS
Table 3. Recommended Operating Condition
Parameter Condition Min. Typ. Max. Units Junction Temperature 115 °C Ambient Temperature -40 85 °C
Outline Drawing
T M G - S IN N IO IT NOTES: [1] PACKAGE BODY MATERIAL: LOW STRESS INJECTION MOLDED PLASTIC D SILICA AND SILICON IMPREGNATED. [2] LEAD AND GROUND PADDLE MATERIAL: COPPER ALLOY. N [3] LEAD AND GROUND PADDLE PLATING: 100% MATTE TIN. [4] DIMENSIONS ARE IN INCHES [MILLIMETERS]. O [5] LEAD SPACING TOLERANCE IS NON-CUMULATIVE. [6] PAD BURR LENGTH SHALL BE 0.15mm MAX. PAD BURR HEIGHT SHALL BE 0.25m MAX. [7] PACKAGE WARP SHALL NOT EXCEED 0.05mm R C [8] ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO PCB GROUND. E [9] REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED PCB LAND PATTERN. W
Table 4. Package Information
O P Part Number Package Body Material Lead Finish MSL Rating Package Marking [1] 976 HMC976LP3E RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn MSL1 [2] XXX X [1] 4-Digit lot number XXXX [2] Max peak reflow temperature of 260 °C [3] For standard HMC976LP3E evaluation board, no heat sink (HS) and no air flow, see figures 14, 15, and 16 InfoFro ma r p tion rfiucre nis, d he e d lbiv y e An raly a og n Ded t viceo p s is la be clie o eved rtd o e b re sa: H ccur iattti e te M and re ilicarbloew . a Ho ve C wever, onro For price, delivery, and to place orders: Analog Devices, Inc., responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other poration, 2 Elizabeth Drive, Chelmsford, MA 01824 One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 5 978-250-3343 tel • 978-250-3373 fax • O rights of third parties that may result from its use. Specifications subject to change without notice. No rd P e h r O one n : 7-lin 81- e a 329-t w 47 w 0 w.h 0 • O it rd teite r o .nc li o n m license is granted by implication or otherwise under any patent or patent rights of Analog Devices. e at www.analog.com Application S Trademarks and registered trademarks are the property of their respective owners. upport: apps@ A h p i p tliti c te ati .ocom n Support: Phone: 1-800-ANALOG-D