Datasheet ADP160, ADP161, ADP162, ADP163 (Analog Devices) - 20

ADP160/ADP161/ADP162/ADP163 Data Sheet OUTLINE DIMENSIONS 2.90 BSC 5 4 1.60 BSC 2.80 BSC 1 2 3 0.95 BSC 1.90 *0.90 MAX BSC 0.70 MIN *1.00 MAX 0.20 0.08 8° 0.10 MAX 0.50 4° SEATING 0.60 0.30 PLANE 0° 0.45 0.30 A *COMPLIANT TO JEDEC STANDARDS MO-193-AB WITH THE EXCEPTION OF PACKAGE HEIGHT AND THICKNESS. 100708-
Figure 53. 5-Lead Thin Small Outline Transistor Package [TSOT] (UJ-5) Dimensions shown in millimeters
1.000 0.965 SQ 0.925 2 1 A BALL A1 IDENTIFIER B 0.50 REF TOP VIEW BOTTOM VIEW (BALL SIDE DOWN) (BALL SIDE UP) 0.370 0.640 0.355 0.595 END VIEW 0.340 0.550 COPLANARITY 0.03 SEATING 0.340 0.270 PLANE A 0.320 0.240 2012- 0.300 0.210 17- 04-
Figure 54. 4-Ball Wafer Level Chip Scale Package [WLCSP] (CB-4-1) Dimensions shown in millimeters Rev. H | Page 20 of 24 Document Outline Features Applications Typical Application Circuits General Description Table of Contents Revision History Specifications Input and Output Capacitor, Recommended Specifications Absolute Maximum Ratings Thermal Data Thermal Resistance ESD Caution Pin Configurations and Function Descriptions Typical Performance Characteristics Theory of Operation Applications Information Capacitor Selection Output Capacitor Input Bypass Capacitor Input and Output Capacitor Properties Enable Feature Current Limit and Thermal Overload Protection Thermal Considerations PCB Layout Considerations Light Sensitivity of WLCSPs Outline Dimensions Ordering Guide