Datasheet ADP122, ADP123 (Analog Devices) - 7

Data Sheet ADP122/ADP123 TYPICAL PERFORMANCE CHARACTERISTICS
VIN = 3.6 V, VOUT = 3.3 V, IOUT = 10 mA, CIN = 1.0 µF, COUT = 1.0 µF, TA = 25°C, unless otherwise noted.
3.300 250 3.295 200 3.290 A) µ IOUT = 300mA ( 3.285 NT 150 IOUT = 200mA (V) IOUT = 100µA UT 3.280 IOUT = 1mA I O OUT = 100mA V IOUT = 10mA 100 3.275 IOUT = 100mA UND CURRE IOUT = 200mA IOUT = 10mA I RO OUT = 300mA G 3.270 50 IOUT = 100µA I 3.265 OUT = 1mA 3.260 0 –40 –5 25 85 125
005
–40 –5 25 85 125
008
JUNCTION TEMPERATURE (°C) JUNCTION TEMPERATURE (°C)
08399- 08399- Figure 9. Output Voltage vs. Junction Temperature Figure 12. Ground Current vs. Junction Temperature
3.2945 200 3.2940 180 3.2935 160 3.2930 A) 140 µ ( 3.2925 NT 120 (V) 3.2920 100 UT OV 3.2915 80 UND CURRE 3.2910 RO 60 G 3.2905 40 3.2900 20 3.2895 0 0.1 1 10 100 1000
006
0.1 1 10 100 1000
009
IOUT (mA) IOUT (mA)
08399- 08399- Figure 10. Output Voltage vs. Load Current Figure 13. Ground Current vs. Load Current
3.296 200 180 IOUT = 300mA 3.294 160 A) 140 µ IOUT = 200mA 3.292 ( NT 120 (V) IOUT = 100mA 3.290 UT 100 OV I 80 OUT = 10mA UND CURRE 3.288 IOUT = 1mA IOUT = 100µA RO 60 G IOUT = 1mA IOUT = 100µA I 40 3.286 OUT = 10mA IOUT = 100mA I 20 OUT = 200mA IOUT = 300mA 3.284 0
007
3.6 3.8 4.0 4.2 4.4 4.6 4.8 5.0 5.2 5.4 3.6 3.8 4.0 4.2 4.4 4.6 4.8 5.0 5.2 5.4
010
VIN (V) V
08399-
IN (V)
08399- Figure 11. Output Voltage vs. Input Voltage Figure 14. Ground Current vs. Input Voltage Rev. E | Page 7 of 24 Document Outline Features Applications General Description Typical Application Circuits Revision History Specifications Recommended Specifications Absolute Maximum Ratings Thermal Data Thermal Resistance ESD Caution Pin Configurations and Function Descriptions Typical Performance Characteristics Theory of Operation Applications Information Capacitor Selection Output Capacitor Input Bypass Capacitor Input and Output Capacitor Properties Undervoltage Lockout Enable Feature Current Limit and Thermal Overload Protection Thermal Considerations Junction Temperature Calculations For TSOT Package Junction Temperature Calculations For LFCSP Package Printed Circuit Board Layout Considerations Outline Dimensions Ordering Guide