Datasheet ADP122, ADP123 (Analog Devices) - 8

ADP122/ADP123 Data Sheet 0.50 3.35 0.45 3.30 IOUT = 10mA A) 0.40 I µ 3.25 OUT = 100mA ( VIN = 3.6V IOUT = 150mA NT V 0.35 IN = 3.8V IOUT = 300mA VIN = 4.2V 3.20 VIN = 4.4V (V) 0.30 VIN = 5.0V UT N CURRE OV 3.15 W VIN = 5.2V 0.25 V DO IN = 5.4V VIN = 5.5V 3.10 HUT 0.20 S 3.05 0.15 0.10 3.00 –50 –25 0 25 50 75 100 125
011
3.05 3.10 3.15 3.20 3.25 3.30 3.35 3.40
013
TEMPERATURE (°C) V
08399-
IN (V)
08399- Figure 15. Shutdown Current vs. Temperature at Various Input Voltages Figure 18. Output Voltage vs. Input Voltage (in Dropout)
70 –10 –20 60 IOUT = 100µA –30 IOUT = 1mA 50 IOUT = 10mA ) –40 IOUT = 100mA mV I ( 40 B) OUT = 200mA d –50 I UT OUT = 300mA O P RR ( 30 S –60 P DRO –70 20 –80 V 10 IN = VOUT + 0.5V –90 VRIPPLE = 50mV
015
CIN = COUT 1µF 0 –100
08399-
1 10 100 1000
012
10 100 1k 10k 100k 1M 10M IOUT (mA) FREQUENCY (Hz)
08399- Figure 16. Dropout Voltage vs. Load Current Figure 19. Power Supply Rejection Ratio vs. Frequency, VOUT = 2.8 V, VIN = 3.3 V
450 –10 400 –20 IOUT = 100µA 350 –30 IOUT = 1mA IOUT = 10mA 300 –40 IOUT = 100mA IOUT = 200mA A) 250 B) µ d –50 I ( OUT = 300mA ND 200 RR ( S –60 I G P 150 –70 100 IOUT = 10mA –80 IOUT = 100mA V I IN = VOUT + 0.5V 50 OUT = 150mA –90 V I RIPPLE = 50mV
016
OUT = 300mA CIN = COUT 1µF 0 –100
08399-
3.05 3.10 3.15 3.20 3.25 3.30 3.35 3.40 3.45
014
10 100 1k 10k 100k 1M 10M VIN (V)
08399-
FREQUENCY (Hz)
Figure 17. Ground Current vs. Input Voltage (in Dropout) Figure 20. Power Supply Rejection Ratio vs. Frequency, VOUT = 3.3 V, VIN = 3.8 V Rev. E | Page 8 of 24 Document Outline Features Applications General Description Typical Application Circuits Revision History Specifications Recommended Specifications Absolute Maximum Ratings Thermal Data Thermal Resistance ESD Caution Pin Configurations and Function Descriptions Typical Performance Characteristics Theory of Operation Applications Information Capacitor Selection Output Capacitor Input Bypass Capacitor Input and Output Capacitor Properties Undervoltage Lockout Enable Feature Current Limit and Thermal Overload Protection Thermal Considerations Junction Temperature Calculations For TSOT Package Junction Temperature Calculations For LFCSP Package Printed Circuit Board Layout Considerations Outline Dimensions Ordering Guide