Datasheet ADP1712, ADP1713, ADP1714 (Analog Devices) - 5

ADP1712/ADP1713/ADP1714 ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE Table 2. Parameter Rating
θJA is specified for the worst-case conditions, that is, a device IN to GND –0.3 V to +6 V soldered in a circuit board for surface-mount packages. OUT to GND –0.3 V to IN
Table 3. Thermal Resistance
EN to GND –0.3 V to +6 V
Package Type θJA Unit
SS/ADJ/BYP/TRK to GND –0.3 V to +6 V 5-Lead TSOT 170 °C/W Storage Temperature Range –65°C to +150°C Operating Junction Temperature Range –40°C to +125°C Lead Temperature, Soldering (10 sec) 300°C
ESD CAUTION
Soldering Conditions JEDEC J-STD-020 Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Rev. A | Page 5 of 16 Document Outline FEATURES APPLICATIONS TYPICAL APPLICATION CIRCUITS GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION SOFT-START FUNCTION (ADP1712) ADJUSTABLE OUTPUT VOLTAGE(ADP1712 ADJUSTABLE) BYPASS CAPACITOR (ADP1713) TRACK MODE (ADP1714) ENABLE FEATURE UNDERVOLTAGE LOCKOUT (UVLO) APPLICATION INFORMATION CAPACITOR SELECTION Output Capacitor Input Bypass Capacitor Input and Output Capacitor Properties CURRENT LIMIT AND THERMAL OVERLOAD PROTECTION THERMAL CONSIDERATIONS PRINTED CIRCUIT BOARD LAYOUT CONSIDERATIONS OUTLINE DIMENSIONS ORDERING GUIDE