ADP1710/ADP1711ABSOLUTE MAXIMUM RATINGSTHERMAL RESISTANCETable 2. Parameter Rating θJA is specified for the worst-case conditions, that is, a device IN to GND –0.3 V to +6 V soldered in a circuit board for surface-mount packages. OUT to GND –0.3 V to IN Table 3. Thermal Resistance EN to GND –0.3 V to +6 V Package TypeθJAUnit ADJ/BYP to GND –0.3 V to +6 V 5-Lead TSOT 170 °C/W Storage Temperature Range –65°C to +150°C Operating Junction Temperature Range –40°C to +125°C Soldering Conditions JEDEC J-STD-020 ESD CAUTION Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Rev. 0 | Page 4 of 16 Document Outline FEATURES APPLICATIONS TYPICAL APPLICATION CIRCUITS GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION ADJUSTABLE OUTPUT VOLTAGE (ADP1710 ADJUSTABLE) BYPASS CAPACITOR (ADP1711) ENABLE FEATURE UNDERVOLTAGE LOCKOUT (UVLO) APPLICATION INFORMATION CAPACITOR SELECTION CURRENT LIMIT AND THERMAL OVERLOAD PROTECTION THERMAL CONSIDERATIONS PRINTED CIRCUIT BOARD LAYOUT CONSIDERATIONS OUTLINE DIMENSIONS ORDERING GUIDE
