Datasheet AD8231 (Analog Devices) - 7

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Data Sheet AD8231 ABSOLUTE MAXIMUM RATINGS Table 4. THERMAL RESISTANCE Parameter Rating Table 5.
Supply Voltage 6 V
Thermal Pad θJA Unit
Output Short-Circuit Current Indefinite1 Soldered to Board 54 °C/W Input Voltage (Common-Mode) −VS − 0.3 V to +VS + 0.3 V Not Soldered to Board 96 °C/W Differential Input Voltage −VS − 0.3 V to +VS + 0.3 V Storage Temperature Range –65°C to +150°C The θJA values in Table 5 assume a 4-layer JEDEC standard Operational Temperature Range –40°C to +125°C board. If the thermal pad is soldered to the board, it is also Package Glass Transition Temperature 130°C assumed it is connected to a plane. θJC at the exposed pad ESD (Human Body Model) 1.5 kV is 6.3°C/W. ESD (Charged Device Model) 1.5 kV
MAXIMUM POWER DISSIPATION
ESD (Machine Model) 0.2 kV The maximum safe power dissipation for the AD8231 is limited 1 For junction temperatures between 105°C and 130°C, short-circuit operation by the associated rise in junction temperature (TJ) on the die. At beyond 1000 hours can impact part reliability. approximately 130°C, which is the glass transition temperature, Stresses at or above those listed under Absolute Maximum the plastic changes its properties. Even temporarily exceeding Ratings may cause permanent damage to the product. This is a this temperature limit may change the stresses that the package stress rating only; functional operation of the product at these exerts on the die, permanently shifting the parametric perform- or any other conditions above those indicated in the operational ance of the amplifiers. Exceeding a temperature of 130°C for an section of this specification is not implied. Operation beyond extended period can result in a loss of functionality. the maximum operating conditions for extended periods may affect product reliability.
ESD CAUTION
Rev. E | Page 7 of 24 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE MAXIMUM POWER DISSIPATION ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS INSTRUMENTATION AMPLIFIER PERFORMANCE CURVES OPERATIONAL AMPLIFIER PERFORMANCE CURVES PERFORMANCE CURVES VALID FOR BOTH AMPLIFIERS THEORY OF OPERATION AMPLIFIER ARCHITECTURE GAIN SELECTION REFERENCE TERMINAL LAYOUT Power Supplies Package Considerations Thermal Pad INPUT BIAS CURRENT RETURN PATH INPUT PROTECTION RF INTERFERENCE COMMON-MODE INPUT VOLTAGE RANGE REDUCING NOISE APPLICATIONS INFORMATION DIFFERENTIAL OUTPUT MULTIPLEXING USING THE AD8231 WITH BIPOLAR SUPPLIES SALLEN KEY FILTER OUTLINE DIMENSIONS ORDERING GUIDE AUTOMOTIVE PRODUCTS