Datasheet AD625 (Analog Devices) - 4

AD625 ABSOLUTE MAXIMUM RATINGS*
Operating Temperature Range Supply Voltage . ± 18 V AD625J/K . 0°C to +70°C Internal Power Dissipation . 450 mW AD625A/B/C . –40°C to +85°C Input Voltage . ± VS AD625S . –55°C to +125°C Differential Input Voltage . ± VS Lead Temperature Range (Soldering 10 sec) . +300°C Output Short Circuit Duration . Indefinite *Stresses above those listed under Absolute Maximum Ratings may cause perma- Storage Temperature Range (D, E) . –65°C to +150°C nent damage to the device. This is a stress rating only; functional operation of the Storage Temperature Range (N) . –65°C to +125°C device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
ORDERING GUIDE Model Temperature Range Package Description Package Option
AD625AD –40°C to +85°C 16-Lead Ceramic DIP D-16 AD625BD –40°C to +85°C 16-Lead Ceramic DIP D-16 AD625BD/+ –40°C to +85°C 16-Lead Ceramic DIP D-16 AD625CD –40°C to +85°C 16-Lead Ceramic DIP D-16 AD625SD –55°C to +125°C 16-Lead Ceramic DIP D-16 AD625SD/883B –55°C to +125°C 16-Lead Ceramic DIP D-16 AD625SE/883B –55°C to +125°C 20-Terminal Leadless Chip Carrier E-20A AD625JN 0°C to +70°C 16-Lead Plastic DIP N-16 AD625KN 0°C to +70°C 16-Lead Plastic DIP N-16 AD625ACHIPS –40°C to +85°C Die AD625SCHIPS –55°C to +125°C Die 5962-87719012A* –55°C to +125°C 20-Terminal Leadless Chip Carrier E-20A 5962-8771901EA* –55°C to +125°C 16-Lead Ceramic DIP D-16 *Standard Military Drawing Available
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
WARNING!
accumulate on the human body and test equipment and can discharge without detection. Although the AD625 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD
ESD SENSITIVE DEVICE
precautions are recommended to avoid performance degradation or loss of functionality.
PIN CONNECTIONS Ceramic DIP (D) and Plastic DIP (N) Packages Leadless Chip Carrier (E) Package +INPUT 1 16 –INPUT +GAIN SENSE 2 15 –GAIN SENSE RTI NULL RTO NULL 3 14 INPUT +INPUT NC GAIN SENSE +GAIN SENSE – – +V 10k –V S 10k S 3 2 1 20 19 4 AD625 13 RTI NULL RTO NULL TOP VIEW +GAIN DRIVE 5 (Not to Scale) 12 –GAIN DRIVE RTI NULL 4 18 RTO NULL RTI NULL 5 17 RTO NULL NC 6 11 SENSE AD625 NC 6 16 TOP VIEW NC REFERENCE 7 10 VOUT +GAIN DRIVE 7 (Not to Scale) 15 –GAIN NULL –V NC 8 14 SENSE S 8 9 +VS NC = NO CONNECT 9 10 11 12 13 S S V – NC +V OUT V REFERENCE NC = NO CONNECT
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