Datasheet AMP01 (Analog Devices) - 10

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AMP01 Data Sheet ABSOLUTE MAXIMUM RATINGS Table 6. THERMAL RESISTANCE Parameter Rating
θJA is specified for the worst-case conditions, that is, a device Supply Voltage ±18 V soldered in a circuit board for surface-mount packages. Internal Power Dissipation1 500 mW
Table 7. Thermal Resistance
Common-Mode Input Voltage Supply voltage
Package Type θ
Differential Input Voltage
JA θJC Unit
R Q-18 (100°C Maximum Ambient) 70.4 10.2 °C/W G ≥ 2 kΩ ±20 V R RW-20 73.7 23.9 °C/W G ≤ 2 kΩ ±10 V Output Short-Circuit Duration Indefinite Storage Temperature Range −65°C to +150°C
ESD CAUTION
Operating Temperature Range AMP01A, AMP01B −55°C to +125°C AMP01E, AMP01F −25°C to +85°C Lead Temperature (Soldering, 60 sec) 300°C Dice Junction Temperature (T J) −65°C to +150°C 1 See Table 7 for maximum ambient temperature rating and derating factor Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. F | Page 10 of 29 Document Outline FEATURES GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ELECTRICAL CHARACTERISTICS DICE CHARACTERISTICS WAFER TEST LIMITS (AMP01NBC) ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION INPUT AND OUTPUT OFFSET VOLTAGES INPUT BIAS AND OFFSET CURRENTS GAIN COMMON-MODE REJECTION ACTIVE GUARD DRIVE GROUNDING SENSE AND REFERENCE TERMINALS DRIVING 50 Ω LOADS HEATSINKING OVERVOLTAGE PROTECTION POWER SUPPLY CONSIDERATIONS APPLICATIONS CIRCUITS OUTLINE DIMENSIONS ORDERING GUIDE