Datasheet TLP3481 (Toshiba) - 6

TLP3481 13. Soldering and Storage 13.1. Precautions for Soldering The soldering temperature should be controlled as closely as possible to the conditions shown below. • When using soldering reflow (See the figure shown below, which is based on the package surface temperature.) Reflow soldering may be performed up to twice. The first reflow soldering should be performed within 168 hours after opening the moisture-proof packaging. The second reflow soldering must be performed within 168 hours of the first reflow. • When using soldering Iron Complete soldering within 10 seconds for lead temperature not exceeding 260 . Heating by soldering iron must be done only once per lead. ©2018-2020 6 2020-06-11 Toshiba Electronic Devices & Storage Corporation Rev.1.0