link to page 1 link to page 1 link to page 2 link to page 4 link to page 5 link to page 6 link to page 7 link to page 8 link to page 8 link to page 8 link to page 9 link to page 10 link to page 12 link to page 12 link to page 13 link to page 13 link to page 14 link to page 15 link to page 15 link to page 16 link to page 17 link to page 18 link to page 18 link to page 19 link to page 19 link to page 23 link to page 25 link to page 26 link to page 27 link to page 29 link to page 29 link to page 30 link to page 31 MLX75026 QVGA Time-of-Flight Sensor PRELIMINARY DATASHEET Table of Contents Features & Benefits... 1 Description.. 1 Table of Contents .. 2 Document Revision History ... 4 Ordering Information .. 5 1. System Architecture .. 6 2. Sensor Block Diagram .. 7 3. Electrical Specifications ... 8 3.1. Absolute Maximum Ratings ... 8 3.2. Typical Operating Conditions ... 8 3.3. Video Interface .. 9 3.4. Power Consumption .. 10 3.5. Maximum Distance Frame Rate .. 12 3.6. Decoupling Recommendations .. 12 3.7. Power-up Sequence ... 13 3.8. Input Clock Requirements ... 13 3.9. I2C Specifications .. 14 4. Optical Characteristics .. 15 4.1. QVGA Pixel Array Configuration .. 15 4.2. Pixel & Image Array Characteristics ... 16 4.3. CRA (Chief Ray Angle) .. 17 4.4. MTF (Modulation Transfer Function) .. 18 4.5. Application Lens Design Recommendations .. 18 5. Communication Interface(s) .. 19 5.1. I2C (Inter-Integrated Circuit) .. 19 5.2. MIPI Alliance CSI-2 Description .. 23 6. Start-up Sequence ... 25 6.1. Initialization Process .. 26 6.2. Initialization Register Map ... 27 7. Register Settings ... 29 7.1. Video Output Configuration .. 29 7.2. Modes of Operation .. 30 7.3. Data Output Modes ... 31 Preliminary Datasheet v0.5 Page 2 of 64 Document Outline Table of Contents Document Revision History Ordering Information 1. System Architecture 2. Sensor Block Diagram 3. Electrical Specifications 3.1. Absolute Maximum Ratings 3.2. Typical Operating Conditions 3.3. Video Interface 3.3.1. MIPI DC specification 3.3.2. MIPI AC specification 3.4. Power Consumption 3.5. Maximum Distance Frame Rate 3.6. Decoupling Recommendations 3.7. Power-up Sequence 3.8. Input Clock Requirements 3.9. I2C Specifications 4. Optical Characteristics 4.1. QVGA Pixel Array Configuration 4.2. Pixel & Image Array Characteristics 4.3. CRA (Chief Ray Angle) 4.4. MTF (Modulation Transfer Function) 4.5. Application Lens Design Recommendations 5. Communication Interface(s) 5.1. I2C (Inter-Integrated Circuit) 5.1.1. I2C Timing Sequence 5.1.2. Single I2C Read 5.1.3. Sequential I2C Read 5.1.4. Single I2C Write 5.1.5. Sequential I2C Write 5.1.6. I2C Slave Address 5.2. MIPI Alliance CSI-2 Description 5.2.1. Packet Structure 5.2.2. Data Format RAW12 5.2.2.1. Data Format in 4 Lane MIPI Configuration 5.2.2.2. Data Format in 2 Lane MIPI Configuration 6. Start-up Sequence 6.1. Initialization Process 6.2. Initialization Register Map 7. Register Settings 7.1. Video Output Configuration 7.2. Modes of Operation 7.3. Data Output Modes 7.4. HMAX & Frame Read-Out Time 7.4.1. PLLSSETUP 7.4.2. PRETIME 7.4.3. RANDNM0 7.5. PARAM_HOLD 7.6. USER_ID Register 7.7. Modulation Frequency 7.8. Frame Structure & Frame Rate 7.9. FRAME_STARTUP 7.10. FRAME_TIME 7.11. PHASE_COUNT 7.12. Px_PREHEAT, Px_PREMIX 7.13. Px_INTEGRATION 7.14. Px_PHASE_SHIFT 7.15. Px_PHASE_IDLE (or V-blanking) 7.16. Px_LEDEN 7.17. Px_DMIX0, Px_DMIX1 & Px_STATIC_LED 7.18. Analog Delay Setting 7.18.1. Coarse Delay 7.18.2. Fine Delay 7.18.3. Super Fine 7.19. Pixel Binning 7.20. Region of Interest (ROI) 7.21. Flip & Mirror 7.22. Temperature Sensor 7.23. Pixel & Phase Statistics 7.24. PN9 Test Pattern 7.25. Duty Cycle Adjustment 7.26. Illumination Signal (subLVDS or CMOS) 8. MetaData Description 8.1. Embedded Data Format in 4 Lane MIPI Configuration 8.2. Embedded Data Format in 2 Lane MIPI Configuration 9. Distance & Amplitude Calculation 10. Package Outline 10.1. Pinout & Equivalent I/O Circuitry 10.2. Mechanical Dimensions 10.3. PCB Landing Pattern & Layout Recommendations 10.4. Package Marking 10.5. Cover Tape Removal Disclaimer
