link to page 32 link to page 34 link to page 34 link to page 35 link to page 36 link to page 37 link to page 37 link to page 37 link to page 38 link to page 40 link to page 41 link to page 42 link to page 42 link to page 43 link to page 44 link to page 46 link to page 47 link to page 48 link to page 48 link to page 49 link to page 52 link to page 53 link to page 54 link to page 54 link to page 56 link to page 56 link to page 57 link to page 58 link to page 58 link to page 61 link to page 62 link to page 62 link to page 63 link to page 64 MLX75026 QVGA Time-of-Flight Sensor PRELIMINARY DATASHEET 7.4. HMAX & Frame Read-Out Time ... 32 7.5. PARAM_HOLD .. 34 7.6. USER_ID Register ... 34 7.7. Modulation Frequency .. 35 7.8. Frame Structure & Frame Rate .. 36 7.9. FRAME_STARTUP ... 37 7.10. FRAME_TIME ... 37 7.11. PHASE_COUNT ... 37 7.12. Px_PREHEAT, Px_PREMIX .. 38 7.13. Px_INTEGRATION ... 40 7.14. Px_PHASE_SHIFT .. 41 7.15. Px_PHASE_IDLE (or V-blanking) ... 42 7.16. Px_LEDEN ... 42 7.17. Px_DMIX0, Px_DMIX1 & Px_STATIC_LED .. 43 7.18. Analog Delay Setting .. 44 7.19. Pixel Binning ... 46 7.20. Region of Interest (ROI) ... 47 7.21. Flip & Mirror .. 48 7.22. Temperature Sensor .. 48 7.23. Pixel & Phase Statistics .. 49 7.24. PN9 Test Pattern .. 52 7.25. Duty Cycle Adjustment .. 53 7.26. Illumination Signal (subLVDS or CMOS) ... 54 8. MetaData Description ... 54 8.1. Embedded Data Format in 4 Lane MIPI Configuration .. 56 8.2. Embedded Data Format in 2 Lane MIPI Configuration .. 56 9. Distance & Amplitude Calculation ... 57 10. Package Outline .. 58 10.1. Pinout & Equivalent I/O Circuitry .. 58 10.2. Mechanical Dimensions ... 61 10.3. PCB Landing Pattern & Layout Recommendations .. 62 10.4. Package Marking .. 62 10.5. Cover Tape Removal .. 63 Disclaimer ... 64 Preliminary Datasheet v0.5 Page 3 of 64 Document Outline Table of Contents Document Revision History Ordering Information 1. System Architecture 2. Sensor Block Diagram 3. Electrical Specifications 3.1. Absolute Maximum Ratings 3.2. Typical Operating Conditions 3.3. Video Interface 3.3.1. MIPI DC specification 3.3.2. MIPI AC specification 3.4. Power Consumption 3.5. Maximum Distance Frame Rate 3.6. Decoupling Recommendations 3.7. Power-up Sequence 3.8. Input Clock Requirements 3.9. I2C Specifications 4. Optical Characteristics 4.1. QVGA Pixel Array Configuration 4.2. Pixel & Image Array Characteristics 4.3. CRA (Chief Ray Angle) 4.4. MTF (Modulation Transfer Function) 4.5. Application Lens Design Recommendations 5. Communication Interface(s) 5.1. I2C (Inter-Integrated Circuit) 5.1.1. I2C Timing Sequence 5.1.2. Single I2C Read 5.1.3. Sequential I2C Read 5.1.4. Single I2C Write 5.1.5. Sequential I2C Write 5.1.6. I2C Slave Address 5.2. MIPI Alliance CSI-2 Description 5.2.1. Packet Structure 5.2.2. Data Format RAW12 5.2.2.1. Data Format in 4 Lane MIPI Configuration 5.2.2.2. Data Format in 2 Lane MIPI Configuration 6. Start-up Sequence 6.1. Initialization Process 6.2. Initialization Register Map 7. Register Settings 7.1. Video Output Configuration 7.2. Modes of Operation 7.3. Data Output Modes 7.4. HMAX & Frame Read-Out Time 7.4.1. PLLSSETUP 7.4.2. PRETIME 7.4.3. RANDNM0 7.5. PARAM_HOLD 7.6. USER_ID Register 7.7. Modulation Frequency 7.8. Frame Structure & Frame Rate 7.9. FRAME_STARTUP 7.10. FRAME_TIME 7.11. PHASE_COUNT 7.12. Px_PREHEAT, Px_PREMIX 7.13. Px_INTEGRATION 7.14. Px_PHASE_SHIFT 7.15. Px_PHASE_IDLE (or V-blanking) 7.16. Px_LEDEN 7.17. Px_DMIX0, Px_DMIX1 & Px_STATIC_LED 7.18. Analog Delay Setting 7.18.1. Coarse Delay 7.18.2. Fine Delay 7.18.3. Super Fine 7.19. Pixel Binning 7.20. Region of Interest (ROI) 7.21. Flip & Mirror 7.22. Temperature Sensor 7.23. Pixel & Phase Statistics 7.24. PN9 Test Pattern 7.25. Duty Cycle Adjustment 7.26. Illumination Signal (subLVDS or CMOS) 8. MetaData Description 8.1. Embedded Data Format in 4 Lane MIPI Configuration 8.2. Embedded Data Format in 2 Lane MIPI Configuration 9. Distance & Amplitude Calculation 10. Package Outline 10.1. Pinout & Equivalent I/O Circuitry 10.2. Mechanical Dimensions 10.3. PCB Landing Pattern & Layout Recommendations 10.4. Package Marking 10.5. Cover Tape Removal Disclaimer
