Datasheet ADA4310-1 (Analog Devices) - 5

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Data Sheet ADA4310-1 ABSOLUTE MAXIMUM RATINGS
package exerts on the die, permanently shifting the parametric
Table 2.
performance of the amplifiers. Exceeding a junction temperature of
Parameter Rating
150°C for an extended period can result in changes in silicon Supply Voltage devices, potentially causing degradation or loss of functionality. 10-Lead MINI_SO_EP 12 V 16-Lead LFCSP ±6V Figure 4 shows the maximum safe power dissipation in the Power Dissipation (T package vs. the ambient temperature for the 10-lead MINI_SO_EP JMAX − TA)/θJA Storage Temperature Range −65°C to +125°C (44°C/W) and for the 16-lead LFCSP (63°C/W) on a JEDEC Operating Temperature Range −40°C to +85°C standard 4-layer board. θJA values are approximations. Lead Temperature (Soldering 10 sec) 300°C
5.0
Junction Temperature 150°C
4.5 )
Stresses at or above those listed under Absolute Maximum
(W 4.0 N
Ratings may cause permanent damage to the product. This is a
TIO 3.5 MINI_SO_EP-10
stress rating only; functional operation of the product at these
PA 3.0 ISSI
or any other conditions above those indicated in the operational
D 2.5
section of this specification is not implied. Operation beyond
ER LFCSP_VQ-16 W 2.0
the maximum operating conditions for extended periods may
M PO
affect product reliability.
1.5 MU XI 1.0 THERMAL RESISTANCE MA 0.5
θJA is specified for the worst-case conditions, that is, θJA is
0
specified for device soldered in circuit board for surface-mount
–35 –15 5 25 45 65 85
016 packages.
AMBIENT TEMPERATURE (°C)
06027- Figure 4. Maximum Power Dissipation vs. Temperature for a 4-Layer Board
Table 3. ESD CAUTION Package Type θJA Unit
10-Lead MINI_SO_EP 44 °C/W 16-Lead LFCSP 63 °C/W
Maximum Power Dissipation
The maximum safe power dissipation for the ADA4310-1 is limited by the associated rise in junction temperature (TJ) on the die. At approximately 150°C, which is the glass transition temperature, the plastic changes its properties. Even temporarily exceeding this temperature limit can change the stresses that the Rev. C | Page 5 of 14 Document Outline FEATURES APPLICATIONS PIN CONFIGURATIONS GENERAL DESCRIPTION REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE Maximum Power Dissipation ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION FEEDBACK RESISTOR SELECTION POWER CONTROL MODES OF OPERATION EXPOSED THERMAL PAD CONNECTIONS POWER LINE APPLICATION BOARD LAYOUT POWER SUPPLY BYPASSING OUTLINE DIMENSIONS ORDERING GUIDE