Data SheetAD8651/AD8652ABSOLUTE MAXIMUM RATINGS Absolute maximum ratings apply at 25°C, unless otherwise noted. Table 3.ESD CAUTIONParameter Rating Supply Voltage 6.0 V Input Voltage GND to VS + 0.3 V Differential Input Voltage ±6.0 V Output Short-Circuit Duration to GND Indefinite Electrostatic Discharge (HBM) 4000 V Storage Temperature Range THERMAL RESISTANCE RM, R Package −65°C to +150°C θJA is specified for the worst-case conditions, that is, a device Operating Temperature Range −40°C to +125°C soldered in a circuit board for surface-mount packages. Junction Temperature Range RM, R Package −65°C to +150°C Table 4. Thermal Resistance Lead Temperature (Soldering, 10 sec) 300°C Package TypeθJAθJC Unit 8-Lead MSOP (RM) 210 45 °C/W Stresses above those listed under Absolute Maximum Ratings 8-Lead SOIC_N (R) 158 43 °C/W may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Rev. D | Page 5 of 20 Document Outline Features Applications Pin Configurations General Description Table of Contents Revision History Specifications Electrical Characteristics Absolute Maximum Ratings ESD Caution Thermal Resistance Typical Performance Characteristics Applications Theory of Operation Rail-to-Rail Output Stage Rail-to-Rail Input Stage Input Protection Overdrive Recovery Layout, Grounding, and Bypassing Considerations Power Supply Bypassing Grounding Leakage Currents Input Capacitance Output Capacitance Settling Time THD Readings vs. Common-Mode Voltage Driving a 16-Bit ADC Outline Dimensions Ordering Guide
