Datasheet AD813 (Analog Devices) - 5

AD813 Model AD813A Conditions V Min Typ Max Units S
MATCHING CHARACTERISTICS Dynamic Crosstalk G = +2, f = 5 MHz +5 V, +3 V –65 dB Gain Flatness Match G = +2, f = 20 MHz +5 V, +3 V 0.1 dB DC Input Offset Voltage T –T +5 V, +3 V 0.5 3.5 mV MIN MAX –Input Bias Current T –T +5 V, +3 V 2 25 µA MIN MAX POWER SUPPLY Operating Range 2.4 36 V Quiescent Current Per Amplifier +5 V 3.2 4.0 mA +3 V 3.0 4.0 mA T –T +5 V 5.0 mA MIN MAX Quiescent Current, Powered Down Per Amplifier +5 V 0.4 0.6 mA +3 V 0.4 0.5 mA Power Supply Rejection Ratio Input Offset Voltage V = +3.0 V to +30 V 76 dB S –Input Current 0.3 µA/V +Input Current 0.005 µA/V DISABLE CHARACTERISTICS Off Isolation f = 5 MHz +5 V, +3 V –55 dB Off Output Impedance G = +1 +5 V, +3 V 13 pF Channel-to-Channel 2 or 3 Channel +5 V, +3 V –65 dB Isolation Mux, f = 5 MHz Turn-On Time +5 V, +3 V 100 ns Turn-Off Time 80 ns TRANSISTOR COUNT 111 NOTES 1Slew rate measurement is based on 10% to 90% rise time in the specified closed-loop gain. 2Single supply differential gain and phase are measured with the ac coupled circuit of Figure 52. Specifications subject to change without notice.
ABSOLUTE MAXIMUM RATINGS1 ORDERING GUIDE
Supply Voltage . ± 18 V
Temperature Package Package
Internal Power Dissipation2
Model Range Description Options
Plastic (N) . 1.6 Watts Small Outline (R) . 1.0 Watts AD813AN –40°C to +85°C 14-Lead Plastic DIP N-14 Input Voltage (Common Mode) . ± VS AD813AR-14 –40°C to +85°C 14-Lead Plastic SOIC R-14 Differential Input Voltage . ± 6 V AD813ACHIPS –40°C to +85°C Die Form Output Short Circuit Duration AD813AR-REEL 13" REEL . Observe Power Derating Curves AD813AR-REEL7 7" REEL Storage Temperature Range N, R . –65°C to +125°C 5962-9559601M2A* –55°C to +125°C 20-Lead LCC Operating Temperature Range *Refer to official DSCC drawing for tested specifications and pin configuration. AD813A . –40°C to +85°C Lead Temperature Range (Soldering 10 sec) . +300°C NOTES 1Stresses above those listed under Absolute Maximum Ratings may cause perma- nent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 2Specification is for device in free air: 14-Lead Plastic DIP Package: θJA = 75°C/W 14-Lead SOIC Package: θJA = 120°C/W REV. B –5–