filename ../../../AppData/Local/Adobe/InDesign/Version 11.0/en_US/Caches/InDesign ClipboardScrap1.pdf filename ../../../AppData/Local/Adobe/InDesign/Version 11.0/en_US/Caches/InDesign ClipboardScrap1.pdf MAX4400–MAX4403 Single/Dual/Quad, Low-Cost, Single-Supply, Rail-to-Rail Op Amps with Shutdown Package Information (continued)14 SOPACKAGE CODES14+1 Outline Number 21-0041 Land Pattern Number 90-0112Thermal Resistance, Single-Layer Board: Junction to Ambient (θJA) 120°C/W Junction to Case (θJC) 37°C/W Thermal Resistance, Four-Layer Board: Junction to Ambient (θJA) 84°C/W Junction to Case (θJC) 34°C/W For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages . Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial . www.maximintegrated.com Maxim Integrated │
