Datasheet MAX4400, MAX4401, MAX4402, MAX4403 (Maxim) - 4

filename ../../../AppData/Local/Adobe/InDesign/Version 11.0/en_US/Caches/InDesign ClipboardScrap1.pdf filename ../../../AppData/Local/Adobe/InDesign/Version 11.0/en_US/Caches/InDesign ClipboardScrap1.pdf MAX4400–MAX4403 Single/Dual/Quad, Low-Cost, Single-Supply, Rail-to-Rail Op Amps with Shutdown
Package Information (continued) 14 SO PACKAGE CODE S14+1
Outline Number
21-0041
Land Pattern Number
90-01 12 Thermal Resistance, Single-Layer Board:
Junction to Ambient (θJA) 120°C/W Junction to Case (θJC) 37°C/W
Thermal Resistance, Four-Layer Board:
Junction to Ambient (θJA) 84°C/W Junction to Case (θJC) 34°C/W For the latest package outline information and land patterns (footprints), go to
www.maximintegrated.com/packages
. Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to
www.maximintegrated.com/thermal-tutorial
. www.maximintegrated.com Maxim Integrated │ 4