Datasheet FT232R (FTDI) - 32

FT232R USB UART IC Datasheet Version 2.16
Document No.: FT_000053 Clearance No.: FTDI# 38
9.2 QFN-32 Package Dimensions Figure 9.2 QFN-32 Package Dimensions
The FT232RQ is supplied in a RoHS compliant leadless QFN-32 package. The package is lead ( Pb ) free, and uses a ‘green’ compound. The package is fully compliant with European Union directive 2002/95/EC. This package is nominally 5.00mm x 5.00mm. The solder pads are on a 0.50mm pitch. The above mechanical drawing shows the QFN-32 package. All dimensions are in millimetres. The centre pad on the base of the FT232RQ is not internally connected, and can be left unconnected, or connected to ground (recommended). The date code format is
YYXX-A
where XX = 2 digit week number, YY = 2 digit year number, A = single letter corresponding to the revision of the device (e.g. A or B or C). The code
XXXXXXX
is the manufacturing LOT code. This only applies to devices manufactured after April 2009. Copyright © Future Technology Devices International Limited 32 Document Outline 1 Typical Applications 1.1 Driver Support 1.2 Part Numbers 1.3 USB Compliant 2 FT232R Block Diagram 3 Device Pin Out and Signal Description 3.1 28-LD SSOP Package 3.2 SSOP Package Pin Out Description 3.3 QFN-32 Package 3.4 QFN-32 Package Signal Description 3.5 CBUS Signal Options 4 Function Description 4.1 Key Features 4.2 Functional Block Descriptions 5 Devices Characteristics and Ratings 5.1 Absolute Maximum Ratings 5.2 DC Characteristics 5.3 EEPROM Reliability Characteristics 5.4 Internal Clock Characteristics 5.5 Thermal Characteristics 6 USB Power Configurations 6.1 USB Bus Powered Configuration 6.2 Self Powered Configuration 6.3 USB Bus Powered with Power Switching Configuration 6.4 USB Bus Powered with Selectable External Logic Supply 7 Application Examples 7.1 USB to RS232 Converter 7.2 USB to RS485 Converter 7.3 USB to RS422 Converter 7.4 USB to MCU UART Interface 7.5 LED Interface 7.6 Using the External Oscillator 8 Internal EEPROM Configuration 9 Package Parameters 9.1 SSOP-28 Package Dimensions 9.2 QFN-32 Package Dimensions 9.3 Solder Reflow Profile 10 Alternative Parts 11 Contact Information Appendix A – References Document References Acronyms and Abbreviations Appendix B – List of Figures and Tables List of Figures List of Tables Appendix C – Revision History