Datasheet MAX4475, MAX4476, MAX4477, MAX4478, MAX4488, MAX4489 (Maxim) - 2

MAX4475–MAX4478/ SOT23, Low-Noise, Low-Distortion, MAX4488/MAX4489 Wide-Band, Rail-to-Rail Op Amps
Absolute Maximum Ratings
Power-Supply Voltage (VDD to VSS) ..-0.3V to +6.0V 8-Pin SO (derate 5.88mW/°C above +70°C) ...471mW Analog Input Voltage (IN_+, IN_-) .(VSS - 0.3V) to (VDD + 0.3V) 14-Pin SO (derate 8.33mW/°C above +70°C) ...667mW SHDN Input Voltage ..(VSS - 0.3V) to +6.0V 14-Pin TSSOP (derate 9.1mW/°C above +70°C) ..727mW Output Short-Circuit Duration to Either Supply ...Continuous Operating Temperature Range ... -40°C to +125°C Continuous Input Current (IN+, IN-) ...±10mA Junction Temperature ..+150°C Continuous Power Dissipation (TA = +70°C) Storage Temperature Range .. -65°C to +150°C 6-Pin SOT23 (derate 5.4mW/°C above +70°C) ...431.3mW Lead Temperature (soldering, 10s) ...+300°C 6-Pin TDFN (derate 18.2mW/°C above 70°C) ..1454mW Soldering Temperature (reflow) ...+260°C 8-Pin µMAX (derate 4.5mW/°C above +70°C) ..362mW Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Package Information SOT23-6 PACKAGE CODE U6F+6
Outline Number
21-0058
Land Pattern Number
90-0175 Thermal Resistance, Single-Layer Board
Junction to Ambient (θJA) 185.5°C/W Junction to Case (θJC) 75°C/W
Thermal Resistance, Multi-Layer Board
Junction to Ambient (θJA) 134.4°C/W Junction to Case (θJC) 39°C/W
µMAX-8 PACKAGE CODE U8+4
Outline Number
21-0036
Land Pattern Number
90-0092 Thermal Resistance, Multi-Layer Board
Junction to Ambient (θJA) 206°C/W Junction to Case (θJC) 42
µMAX-8 PACKAGE CODE U8+1
Outline Number
21-0036
Land Pattern Number
90-0092 Thermal Resistance, Single-Layer Board
Junction to Ambient (θJA) 221°C/W Junction to Case (θJC) 42°C/W
Thermal Resistance, Multi-Layer Board
Junction to Ambient (θJA) 206°C/W Junction to Case (θJC) 42°C/W www.maximintegrated.com Maxim Integrated │ 2