Datasheet MAX4475, MAX4476, MAX4477, MAX4478, MAX4488, MAX4489 (Maxim) - 4

MAX4475–MAX4478/ SOT23, Low-Noise, Low-Distortion, MAX4488/MAX4489 Wide-Band, Rail-to-Rail Op Amps
Package Information (continued) TDFN-6 PACKAGE CODE T633+2
Outline Number
21-0137
Land Pattern Number
90-0058 Thermal Resistance, Single-Layer Board
Junction to Ambient (θJA) 55°C/W Junction to Case (θJC) 9°C/W
Thermal Resistance, Multi-Layer Board
Junction to Ambient (θJA) 42°C/W Junction to Case (θJC) 9°C/W For the latest package outline information and land patterns (footprints), go to
www.maximintegrated.com/packages
. Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to
www.maximintegrated.com/thermal-tutorial
. www.maximintegrated.com Maxim Integrated │ 4