K857PEwww.vishay.com Vishay Semiconductors
SOLDER PROFILE DRYPACKAxis Title Devices are packed in moisture barrier bags (MBB) to 300 10000 prevent the products from moisture absorption during Max. 260 °C transportation and storage. Each bag contains a desiccant. 255 °C 250 245 °C 240 °C 217 °C
FLOOR LIFE200 1000 Time between soldering and removing from MBB must not Max. 30 s ine ne ne exceed the time indicated in J-STD-020: 150 1st li Moisture sensitivity: level 3 2nd l 2nd li Max. 120 s Max. 100 s 100 100 Floor life: 168 h Temperature (°C) Max. ramp down 6 °C/s Conditions: Tamb < 30 °C, RH < 60 % 50 Max. ramp up 3 °C/s
DRYING0 10 In case of moisture absorption devices should be 0 50 100 150 200 250 300 baked before soldering. Conditions see J-STD-033D or 19841 Time (s) recommended conditions: Fig. 7 - Lead (Pb)-free Reflow Solder Profile According to J-STD-020D 192 h at 40 °C (+ 5 °C), RH < 5 % or 96 h at 60 °C (+ 5 °C), RH < 5 % Rev. 1.0, 10-Sep-2020
6Document Number: 80136 For technical questions, contact:
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