Datasheet T3035H-8G (STMicroelectronics) - 5

360° T3035H-8G Characteristics (curves) Figure 8. Relative variation of leakage current versus Figure 7. Thermal resistance junction to ambient versus junction temperature for different values of blocking copper surface under tab voltage
Rth(j-a) (°C/W) IDRM/IRRM [Tj, VDRM/VRRM] / IDRM/IRRM [Tj max.,800 V] 80 1.0E+00 D²PAK Epoxy printed circuit board FR4, e = 35 µm Cu 70 1.0E-01 60 VDRM = VRRM = 800 V 50 1.0E-02 40 V 30 1.0E-03 DRM = VRRM = 600 V 20 S 1.0E-04 Cu(cm²) 10 T 0 j(°C) 1.0E-05 0 5 10 15 20 25 30 35 40 25 50 75 100 125 150
Figure 10. Relative variation of holding current and Figure 9. Relative variation of gate trigger voltage and latching current versus junction temperature (typical current versus junction temperature (typical values) values)
IGT,VGT[Tj] / IGT,VGT[Tj = 25 °C] IH,IL [Tj] / IH,IL [Tj = 25 °C] 3.0 1.5 2.5 I 2.0 GT Q3 1.0 IL 1.5 IGT Q1-Q2 1.0 VGT Q1-Q2-Q3 0.5 IH 0.5 Tj (°C) Tj (°C) 0.0 0.0 -50 -25 0 25 50 75 100 125 150 -50 -25 0 25 50 75 100 125 150
Figure 11. Surge peak on-state current versus number of Figure 12. Non repetitive surge peak on-state current for a cycles sinusoidal pulse with width tp < 10 ms
I I TSM(A) TSM(A) 10000 300 dl/dt limitation: 100 A/µs Tj initial = 25 °C 250 t=20ms Non repetitive One cycle 200 T 1000 j initial = 25 °C ITSM 150 100 100 50 Repetitive Tc = 121°C Number of cycles 0 tp(ms) 1 10 100 1000 10 0.01 0.10 1.00 10.00
DS12705
-
Rev 5 page 5/12
α Document Outline 1 Characteristics 1.1 Characteristics (curves) 2 Package information 2.1 D²PAK package information 3 Ordering information Revision history