Datasheet T3035H-8G (STMicroelectronics) - 7

T3035H-8G Package information 2 Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark.
2.1 D²PAK package information
• ECOPACK2 compliant • Lead-free package leads finishing • Molding compound resin is halogen-free and meets UL94 flammability standard level V0
Figure 15. D²PAK package outline
A E E1 c2 E2 L2 D1 D H 1 2 3 D2 L3 b2 e b Max resin gate protrusion: 0.5 mm (1) G A1 A2 A3 R L Gauge Plane c V2 (1) Resin gate is accepted in each of position shown on the drawing, or their symmetrical.
DS12705
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Rev 5 page 7/12
Document Outline 1 Characteristics 1.1 Characteristics (curves) 2 Package information 2.1 D²PAK package information 3 Ordering information Revision history