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Datasheet STM32WB5MMG (STMicroelectronics) - 22

ПроизводительSTMicroelectronics
ОписаниеBluetooth Low Energy 5.0 and 802.15.4 module
Страниц / Страница31 / 22 — STM32WB5MMG. Ordering information. Device family. Product type. Device …
Формат / Размер файлаPDF / 3.7 Мб
Язык документаанглийский

STM32WB5MMG. Ordering information. Device family. Product type. Device subfamily. Pin count. Component type. Flash memory size. Package

STM32WB5MMG Ordering information Device family Product type Device subfamily Pin count Component type Flash memory size Package

27 предложений от 9 поставщиков
IC: ARM microcontroller; 64MHz; LGA86; 1.8÷3.6VDC; -40÷85°C
Lixinc Electronics
Весь мир
STM32WB5MMGH6TR
STMicroelectronics
1 055 ₽
727GS
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STM32WB5MMGH6TR
STMicroelectronics
1 055 ₽
STM32WB5MMGH6TR
STMicroelectronics
от 1 531 ₽
STM32WB5MMGH6TR
STMicroelectronics
от 1 631 ₽
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Текстовая версия документа

STM32WB5MMG Ordering information 10 Ordering information
Example: STM32 WB 5 M M G H 6 TR
Device family
STM32 = Arm-based 32-bit microcontroller
Product type
WB = Wireless Bluetooth®
Device subfamily
5 = STM32WB55, Die 5, full set of features
Pin count
M = 86 pins
Component type
M= module
Flash memory size
G = 1 Mbyte
Package
H = LGA 86 7.3 x 11 mm
Temperature range
6 = Industrial temperature range, –40 to 85 °C
Packing
TR = tape and reel For a list of available options (such as speed and package) or for further information on any aspect of this device, contact your nearest ST sales office.
DS13252
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Rev 1 page 22/31
Document Outline 1 Introduction 2 Description 3 Available peripherals 4 Pin description 5 Recommendations 5.1 Pin recommendations 5.2 Layout recommendations 5.2.1 STM32WB5MMG placement 5.2.2 Enclosure effects 5.2.3 Ground plane 5.2.4 Sensitive GPIOs 5.2.5 Four layer reference board design 6 Electrical characteristics 6.1 Operating conditions 6.2 Power consumption 6.3 RF characteristics 6.4 Antenna radiation patterns and efficiency 7 Thermal characteristics 8 Solder re-flow recommendation 9 Package information 9.1 SiP-LGA86 package information 9.1.1 Device marking for SiP-LGA86 10 Ordering information 11 Tape and reel packing 12 Certification 12.1 CE certification 12.2 FCC certification 12.3 ISED certification 12.4 JRF certification 12.5 NCC certification 12.6 SRRC certification Revision history Contents List of tables List of figures
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