Datasheet IRFP450, SiHFP450 (Vishay) - 9

Package Information
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VERSION 2: FACILITY CODE = Y
A A 4 E B 7 ØP (Datum B) E/2 S A2 Ø k M D B M R/2 3 ØP1 A D2 Q 4 2 x R 4 D1 (2) D 1 2 3 D 4 Thermal pad L1 5 C L 4 E1 See view B A 0.01 M D B M 2 x b2 C View A - A 2 x e 3 x b b4 A1 0.10 M C A M (b1, b3, b5) Planting Base metal Lead Assignments 1. Gate D D E E 2. Drain (c) c1 3. Source C C 4. Drain (b, b2, b4) (4) Section C - C, D - D, E - E View B
MILLIMETERS MILLIMETERS DIM. MIN. MAX. NOTES DIM. MIN. MAX. NOTES
A 4.58 5.31 D2 0.51 1.30 A1 2.21 2.59 E 15.29 15.87 A2 1.17 2.49 E1 13.72 - b 0.99 1.40 e 5.46 BSC b1 0.99 1.35 Ø k 0.254 b2 1.53 2.39 L 14.20 16.25 b3 1.65 2.37 L1 3.71 4.29 b4 2.42 3.43 Ø P 3.51 3.66 b5 2.59 3.38 Ø P1 - 7.39 c 0.38 0.86 Q 5.31 5.69 c1 0.38 0.76 R 4.52 5.49 D 19.71 20.82 S 5.51 BSC D1 13.08 -
Notes
(1) Dimensioning and tolerancing per ASME Y14.5M-1994 (2) Contour of slot optional (3) Dimension D and E do not include mold flash. Mold flash shall not exceed 0.127 mm (0.005") per side. These dimensions are measured at the outermost extremes of the plastic body (4) Thermal pad contour optional with dimensions D1 and E1 (5) Lead finish uncontrolled in L1 (6) Ø P to have a maximum draft angle of 1.5 to the top of the part with a maximum hole diameter of 3.91 mm (0.154") (7) Outline conforms to JEDEC outline TO-247 with exception of dimension c Revision: 19-Oct-2020
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