Datasheet BPF8089-01SC6 (STMicroelectronics) - 8

link to page 8
BPF8089-01SC6 Package information 3 Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark.
3.1 SOT23-6L package information Figure 11. SOT23-6L package outline
c A1 θ L A H E e D b e A2
Table 3. SOT23-6L package mechanical data Dimensions Ref. Millimeters Inches(1) Min. Typ. Max. Min. Typ. Max.
A 0.9 1.45 0.0354 0.0571 A1 0 0.15 0 0.0059 A2 0.9 1.3 0.0354 0.0512 b 0.30 0.5 0.0118 0.0197 c 0.09 0.2 0.0035 0.0079 D 2.8 3.05 0.1102 0.1201 E 1.5 1.75 0.0591 0.0689 e 0.95 0.0374 H 2.6 3 0.1024 0.1181 L 0.3 0.6 0.0118 0.0236 θ 0 10 0 0.3937 1. Value in inches are converted from mm and rounded to 4 decimal digits
DS13416
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Rev 1 page 8/14
Document Outline Cover image Application schematic Product status link / summary Features Applications Description 1 Characteristics 1.1 Characteristics (curves) 2 Recommendation on PCB assembly 2.1 Solder paste 3 Package information 3.1 SOT23-6L package information 3.2 Reflow profile 4 Ordering information Revision history