Datasheet MBR0540T3G, NRVB0540T1G, MBR0540T3G, NRVB0540T3G (ON Semiconductor) - 5

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS SOD−123
CASE 425−04 ISSUE G DATE 07 OCT 2009
SCALE 5:1 D A
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI
A1
Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH.
1 MILLIMETERS INCHES
ÂÂÂÂ
DIM MIN NOM MAX MIN NOM MAX A
0.94 1.17 1.35 0.037 0.046 0.053 ÂÂÂÂ
A1
0.00 0.05 0.10 0.000 0.002 0.004
b
0.51 0.61 0.71 0.020 0.024 0.028 ÂÂÂÂ
HE E c
--- --- 0.15 --- --- 0.006
D
1.40 1.60 1.80 0.055 0.063 0.071
E
2.54 2.69 2.84 0.100 0.106 0.112
H
3.56
E
3.68 3.86 0.140 0.145 0.152
L
0.25 --- --- 0.010 --- --- --- ° 10 ---
q
0 ° 0° 10°
2 q GENERIC b L MARKING DIAGRAM* C
XXXMG
SOLDERING FOOTPRINT*
1 G 0.91 XXX = Specific Device Code 0.036 M = Date Code ÉÉÉ ÉÉÉ G = Pb−Free Package 1.22 (Note: Microdot may be in either location) ÉÉÉ ÉÉÉ 0.048 *This information is generic. Please refer to device data ÉÉÉ ÉÉÉ sheet for actual part marking. Pb−Free indicator, “G” or 2.36 microdot “ G”, may or may not be present. 0.093 4.19 STYLE 1: 0.165 PIN 1. CATHODE 2. ANODE SCALE 10:1 ǒ mm Ǔ inches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER: 98ASB42927B
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DESCRIPTION: SOD−123 PAGE 1 OF 1
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