Datasheet LT8636, LT8637 (Analog Devices) - 2

LT8636/LT8637
ABSOLUTE MAXIMUM RATINGS (Note 1)
Operating Junction Temperature Range (Note 2) VIN, EN/UV, PG ..42V LT8636E/LT8637E ... –40°C to 125°C BIAS ..25V LT8636J/LT8637J .. –40°C to 150°C FB, TR/SS . ...4V LT8636H .. –40°C to 150°C SYNC/MODE Voltage . ..6V LT8636MP ... –55°C to 150°C Storage Temperature Range .. –65°C to 150°C Maximum Reflow (Package Body) Temperature ...260°C
PIN CONFIGURATION
LT8636 LT8637 TOP VIEW TOP VIEW FB FB TR/SS RT FB V C TR/SS RT 20 19 18 17 20 19 18 17 PG 1 16 CLKOUT PG 1 16 CLKOUT BIAS 2 15 SYNC/MODE BIAS 2 15 SYNC/MODE INTV INTV 3 14 EN/UV CC 3 14 EN/UV 21 CC 21 GND GND 4 GND 13 GND GND 4 13 GND NC 5 12 NC NC 5 12 NC V V 6 11 V IN 6 11 VIN IN IN 7 8 9 10 7 8 9 10 BST SW SW SW BST SW SW SW LQFN PACKAGE LQFN PACKAGE 20-LEAD (4mm × 3mm × 0.94mm) 20-LEAD (4mm × 3mm × 0.94mm) JEDEC BOARD: θJA = 41°C/W, θJC(top) = 50.6°C/W, JEDEC BOARD: θJA = 41°C/W, θJC(top) = 50.6°C/W, θJC(pad) = 8.0°C/W, (NOTE 3) θJC(pad) = 8.0°C/W, (NOTE 3) DEMO BOARD: θJA = 26°C/W, ΨJT = 0.8°C/W DEMO BOARD: θJA = 26°C/W, ΨJT = 0.8°C/W EXPOSED PAD (PIN 21) IS GND, SHOULD BE SOLDERED TO PCB EXPOSED PAD (PIN 21) IS GND, SHOULD BE SOLDERED TO PCB
ORDER INFORMATION PACKAGE MSL PART NUMBER PART MARKING* FINISH CODE PAD FINISH TYPE** RATING TEMPERATURE RANGE
LT8636EV#PBF –40°C to 125°C LT8636JV#PBF –40°C to 150°C 8636 LT8636HV#PBF –40°C to 150°C e4 Au (RoHS) LQFN (Laminate Package LT8636MPV#PBF with QFN Footprint) 3 –55°C to 150°C LT8637EV#PBF –40°C to 125°C 8637 LT8637JV#PBF –40°C to 150°C Rev. C 2 For more information www.analog.com Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Operation Applications Information Package Description Revision History Typical Applications Related Parts