Datasheet LT8606, LT8606B (Analog Devices) - 21

LT8606/LT8606B
PACKAGE DESCRIPTION MSE Package 10-Lead Plastic MSOP, Exposed Die Pad
(Reference LTC DWG # 05-08-1664 Rev I) BOTTOM VIEW OF EXPOSED PAD OPTION 1.88 ±0.102 1.88 0.889 ±0.127 1 (.074 ±.004) (.074) 0.29 (.035 ±.005) 1.68 REF (.066) 5.10 0.05 REF (.201) 1.68 ±0.102 3.20 – 3.45 DETAIL “B” MIN (.066 ±.004) (.126 – .136) CORNER TAIL IS PART OF DETAIL “B” THE LEADFRAME FEATURE. 10 FOR REFERENCE ONLY 0.50
NO MEASUREMENT PURPOSE
0.305 ± 0.038 (.0197) 3.00 ±0.102 (.0120 ±.0015) BSC (.118 ±.004) 0.497 ±0.076 TYP (NOTE 3) (.0196 ±.003) RECOMMENDED SOLDER PAD LAYOUT 10 9 8 7 6 REF 4.90 ±0.152 3.00 ±0.102 (.193 ±.006) (.118 ±.004) (NOTE 4) DETAIL “A” 0.254 (.010) 0° – 6° TYP 1 2 3 4 5 GAUGE PLANE 0.53 ±0.152 1.10 0.86 (.021 ±.006) (.043) (.034) MAX REF DETAIL “A” 0.18 (.007) SEATING PLANE 0.17 – 0.27 0.1016 ±0.0508 (.007 – .011) (.004 ±.002) TYP 0.50 MSOP (MSE) 0213 REV I (.0197) NOTE: BSC 1. DIMENSIONS IN MILLIMETER/(INCH) 2. DRAWING NOT TO SCALE 3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS. INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX 6. EXPOSED PAD DIMENSION DOES INCLUDE MOLD FLASH. MOLD FLASH ON E-PAD SHALL NOT EXCEED 0.254mm (.010") PER SIDE. Rev. D For more information www.analog.com 21 Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Pin Functions Block Diagram Operation Applications Information Typical Applications Package Description Revision History Typical Application Related Parts