Datasheet AD823 (Analog Devices) - 6

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AD823 Data Sheet ABSOLUTE MAXIMUM RATINGS Table 4. THERMAL RESISTANCE Parameter Rating
θJA is specified for the worst-case conditions, that is, a device Supply Voltage 36 V soldered in a circuit board for surface-mount packages. Internal Power Dissipation Specification is for device in free air. PDIP (N) 1.3 W SOIC (R) 0.9 W
Table 5. Thermal Resistance
Input Voltage (Common Mode) ±VS
Package Type θJA Unit
Differential Input Voltage ±VS 8-Lead PDIP 90 °C/W Output Short-Circuit Duration See Figure 4 8-Lead SOIC 160 °C/W Storage Temperature Range N, R −65°C to +125°C Operating Temperature Range −40°C to +85°C
2.0
Lead Temperature Range 300°C
TJ = 150°C 8-LEAD PDIP
(Soldering, 10 sec)
W)
Stresses above those listed under Absolute Maximum Ratings
( 1.5
may cause permanent damage to the device. This is a stress
TION PA
rating only; functional operation of the device at these or any
ISSI
other conditions above those indicated in the operational
D 1.0 ER
section of this specification is not implied. Exposure to absolute
W
maximum rating conditions for extended periods may affect
M PO 8-LEAD SOIC
device reliability.
MU 0.5 XI MA 0 –50 –40 –30 –20 –10 0 10 20 30 40 50 60 70 80 90
004
AMBIENT TEMPERATURE (°C)
00901- Figure 4. Maximum Power Dissipation vs. Temperature
ESD CAUTION
Rev. E | Page 6 of 20 Document Outline Features Applications Connection Diagram General Description Table of Contents Revision History Specifications Absolute Maximum Ratings Thermal Resistance ESD Caution Typical Performance Characteristics Theory of Operation Output Impedance Application Notes Input Characteristics Output Characteristics A/D Driver 3 V, Single-Supply Stereo Headphone Driver Second-Order Low-Pass Filter Single-Supply Half-Wave and Full-Wave Rectifiers Outline Dimensions Ordering Guide