Datasheet NC7SZ04 (ON Semiconductor) - 8

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS SC−74A
CASE 318BQ 5 ISSUE B 1 DATE 18 JAN 2018
SCALE 2:1 5X b
NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME 0.20 C A B Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS.
M
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
5 4
THICKNESS. MINIMUM LEAD THICKNESS IS THE
E1 E
MINIMUM THICKNESS OF BASE MATERIAL.
1 2 3
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD 0.05
A1
FLASH, PROTRUSIONS, OR GATE BURRS. MOLD
L
FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT
B e
EXCEED 0.15 PER SIDE.
DETAIL A A D MILLIMETERS DIM MIN MAX TOP VIEW A
0.90 1.10
A1
0.01 0.10
A DETAIL A b
0.25 0.50
c
0.10 0.26
D
2.85 3.15
E
2.50 3.00
E1 c
1.35 1.65
e
0.95 BSC
C SEATING SIDE VIEW END VIEW PLANE L
0.20 0.60
M
0 10 _ _
RECOMMENDED GENERIC SOLDERING FOOTPRINT* MARKING DIAGRAM*
0.95 PITCH XXX MG G XXX = Specific Device Code 2.40 M = Date Code G = Pb−Free Package (Note: Microdot may be in either location) *This information is generic. Please refer to device data sheet for actual part marking. 5X Pb−Free indicator, “G” or microdot “ 1.00 5X G”, 0.70 may or may not be present. Some products may not follow the Generic Marking. DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER: 98AON66279G
Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DESCRIPTION: SC−74A PAGE 1 OF 1
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