Datasheet AD8051, AD8052, AD8054 (Analog Devices) - 9

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Data Sheet AD8051/ AD8052/ AD8054 ABSOLUTE MAXIMUM RATINGS Table 4. MAXIMUM POWER DISSIPATION Parameter Ratings
The maximum power that can be safely dissipated by the Supply Voltage 12.6 V AD8051/AD8052/AD8054 is limited by the associated rise in Internal Power Dissipation1 junction temperature. The maximum safe junction temperature SOIC Packages Observe power for plastic encapsulated devices is determined by the glass derating curves transition temperature of the plastic, approximately 150°C. SOT-23 Package Observe power Temporarily exceeding this limit can cause a shift in parametric derating curves performance due to a change in the stresses exerted on the die MSOP Package Observe power by the package. Exceeding a junction temperature of 175°C for derating curves an extended period can result in device failure. TSSOP Package Observe power derating curves While the AD8051/AD8052/AD8054 are internally short- Input Voltage (Common Mode) ±VS circuit protected, this cannot be sufficient to guarantee that the Differential Input Voltage ±2.5 V maximum junction temperature (150°C) is not exceeded under Output Short-Circuit Duration Observe power all conditions. To ensure proper operation, it is necessary to derating curves observe the maximum power derating curves. Storage Temperature Range (R) −65°C to +150°C
2.5
Operating Temperature Range (A Grade) −40°C to +125°C Lead Temperature (Soldering 10 sec) 300°C
) (W SOIC-14 2.0 N
1 See Table 5.
IO TSSOP-14 AT
Stresses at or above those listed under Absolute Maximum
IP S 1.5 SOIC-8 S
Ratings may cause permanent damage to the product. This is a
R DI
stress rating only; functional operation of the product at these
E W 1.0 O
or any other conditions above those indicated in the operational
P MSOP-8
section of this specification is not implied. Operation beyond
UM IM
the maximum operating conditions for extended periods may
0.5 AX SOT-23-5 M
affect product reliability.
0 THERMAL RESISTANCE
06
–55 –35 –15 5 15 35 55 75 95 115
0 2-
AMBIENT TEMPERATURE (°C)
06 Specification is for device in free air. 01 Figure 6. Maximum Power Dissipation vs. Temperature for AD8051/AD8052/AD8054
Table 5. Thermal Resistance Package Type θJA θJC ΨJT ΨJB Unit ESD CAUTION
8-Lead SOIC 125 86 2 90 °C/W 5-Lead SOT-23 180 67 1.0 50 °C/W 8-Lead MSOP 150 80 2.5 90 °C/W 14-Lead SOIC 90 36 1.9 60 °C/W 14-Lead TSSOP 120 22 0.3 75 °C/W Rev. K | Page 9 of 24 Document Outline FEATURES APPLICATIONS PIN CONNECTIONS (TOP VIEWS) GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE MAXIMUM POWER DISSIPATION ESD CAUTION TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION CIRCUIT DESCRIPTION APPLICATION INFORMATION OVERDRIVE RECOVERY DRIVING CAPACITIVE LOADS LAYOUT CONSIDERATIONS ACTIVE FILTERS ANALOG-TO-DIGITAL AND DIGITAL-TO-ANALOG APPLICATIONS SYNC STRIPPER SINGLE-SUPPLY COMPOSITE VIDEO LINE DRIVER OUTLINE DIMENSIONS ORDERING GUIDE