Datasheet HMC7543 (Analog Devices) - 7

Data Sheet HMC7543 TYPICAL PERFORMANCE CHARACTERISTICS 30 25 25 GAIN 24 20 23 TA = –55°C 15 22 T ) A = +25°C B 10 21 B) SE (d d N 5 20 N ( TA = +85°C AI 0 G ESPO 19 R –5 18 INPUT RETURN LOSS –10 17 –15
009
16
012
OUTPUT RETURN LOSS –20
13423-
15
13423-
69 70 71 72 73 74 75 76 77 78 71.0 71.5 72.0 72.5 73.0 73.5 74.0 74.5 75.0 75.5 76.0 FREQUENCY (GHz) FREQUENCY (GHz)
Figure 9. Broadband Gain and Return Loss Response vs. Frequency, Figure 12. Gain vs. Frequency at Various Temperatures, Drain Current (IDD) = 450 mA Drain Current (IDD) = 450 mA
25 0 24 –2 23 –4 B) 22 d I –6 DD = 450mA ( S S 21 O –8 B) d IDD = 400mA 20 N ( –10 URN L AI IDD = 350mA T TA = –55°C G 19 –12 RE UT 18 TA = +25°C –14 INP 17 –16 TA = +85°C 16
010
–18
013
15
13423- 13423-
–20 71.0 71.5 72.0 72.5 73.0 73.5 74.0 74.5 75.0 75.5 76.0 71.0 71.5 72.0 72.5 73.0 73.5 74.0 74.5 75.0 75.5 76.0 FREQUENCY (GHz) FREQUENCY (GHz)
Figure 10. Gain vs. Frequency at Various Drain Currents (IDD) Figure 13. Input Return Loss vs. Frequency at Various Temperatures, Drain Current (IDD) = 450 mA
0 –40 –2 –42 –4 –44 ) B) d ( –6 dB –46 S ( S O –8 TION –48 A L –10 URN L TA = +85°C –50 T SO –12 RE SE I –52 T TA = +25°C UT A = +25°C T –14 A = –55°C –54 UP EVER O TA = –55°C R –16 –56
1
–18
1 0
–58
014
TA = +85°C –20
13423- 13423-
–60 71.0 71.5 72.0 72.5 73.0 73.5 74.0 74.5 75.0 75.5 76.0 71.0 71.5 72.0 72.5 73.0 73.5 74.0 74.5 75.0 75.5 76.0 FREQUENCY (GHz) FREQUENCY (GHz)
Figure 11. Output Return Loss vs. Frequency at Various Temperatures, Figure 14. Reverse Isolation vs. Frequency at Various Temperatures, Drain Current (IDD) = 450 mA Drain Current (IDD) = 450 mA Rev. A | Page 7 of 16 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION TYPICAL APPLICATION CIRCUIT ASSEMBLY DIAGRAM MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICS HANDLING PRECAUTIONS Storage Cleanliness Static Sensitivity Transients General Handling MOUNTING Eutectic Die Attach Epoxy Die Attach WIRE BONDING OUTLINE DIMENSIONS ORDERING GUIDE