Datasheet HMC1082LP4E (Analog Devices) - 7

HMC1082LP4E
v05.1018
GaAs pHEMT MMIC MEDIUM POWER AMPLIFIER, 5.5 - 18 GHz Absolute Maximum Ratings Typical Supply Current vs. Vdd
Drain Bias Voltage (Vdd) 5.5V Vdd (V) Idd (mA) T RF Input Power (RFIN) 20 dBm +4 220 M Channel Temperature 175 °C +4.5 220 Continuous Pdiss (T=85 °C) +5 220 1.81W (derate 20mW/°C R - S Thermal Resistance (RTH) 49.8 °C/W Adjust Vgg1 to achieve Idd = 220mA (junction to ground paddle) E Operating Temperature -40°C to +85°C W Storage Temperature -65°C to 150°C O ESD Sensitivity (HBM) Class 0, Passed 100V ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS R & P
24-Lead Lead Frame Chip Scale Package [LFCSP]
A
4 x 4 mm Body and 0.85 mm Package Height
E
Outline Drawing (HCP-24-3) Dimensions shown in millimeters
IN
DETAIL A (JEDEC 95) 4.10 0.30 4.00 SQ
S - L
0.25 PIN 1 3.90 0.18 PIN 1
R
INDICATOR INDICATOR AREA OPTIONS (SEE DETAIL A) 19 24
IE
18 1 0.50 BSC 2.85
LIF
EXPOSED PAD 2.70 SQ
P
2.55
M
13 6
A
0.50 12 7 TOP VIEW 0.20 MIN 0.40 BOTTOM VIEW 0.30 0.95 FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO 0.85 SIDE VIEW THE PIN CONFIGURATION AND 0.75 0.05 MAX FUNCTION DESCRIPTIONS 0.02 NOM SECTION OF THIS DATA SHEET. COPLANARITY SEATING 0.08 PLANE 0.20 REF PKG-04940 12-08-2017-C
24-Lead Lead Frame Chip Scale Package [LFCSP] 4 mm × 4 mm Body and 0.85 mm Package Height (HCP-24-3) Dimensions shown in millimeters
Package Information
Part Number Package Body Material Lead Finish MSL Rating [2] Package Marking [1] H1082 HMC1082LP4E RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn MSL1 XXXX [1] 4-Digit lot number XXXX [2] Max peak reflow temperature of 260 °C For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 781-329-4700 • Order online at www.analog.com
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Application Support: Phone: 1-800-ANALOG-D