Datasheet ADL5605 (Analog Devices) - 6

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ADL5605 Data Sheet ABSOLUTE MAXIMUM RATINGS Table 3. THERMAL RESISTANCE Parameter Rating
Table 4 lists the junction-to-air thermal resistance (θJA) and the Supply Voltage, VCC11 6.5 V junction-to-paddle thermal resistance (θJC) for the ADL5605. Input Power (50 Ω Impedance) 20 dBm For more information, see the Thermal Considerations section. Internal Power Dissipation (Paddle Soldered) 2 W Maximum Junction Temperature 150°C
Table 4. Thermal Resistance
Lead Temperature (Soldering 60 sec) 240°C
Package Type θJA θJC Unit
Operating Temperature Range −40°C to +85°C 16-Lead LFCSP (CP-16-20) 52.1 12.1 °C/W Storage Temperature Range −65°C to +150°C 1 VCC1 is the supply to the DUT through the RFOUT pins.
ESD CAUTION
Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. B | Page 6 of 18 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS TYPICAL SCATTERING PARAMETERS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS 748 MHZ FREQUENCY TUNING BAND 881 MHZ FREQUENCY TUNING BAND 943 MHZ FREQUENCY TUNING BAND GENERAL APPLICATIONS INFORMATION BASIC LAYOUT CONNECTIONS Power Supply RF Input Interface RF Output Interface Power-Down ADL5605 MATCHING ACPR AND EVM THERMAL CONSIDERATIONS SOLDERING INFORMATION AND RECOMMENDED PCB LAND PATTERN EVALUATION BOARD OUTLINE DIMENSIONS ORDERING GUIDE