HMC-AUH249 v04.0909 GaAs HEMT MMIC MODULATORDRIVER AMPLIFIER, DC - 35 GHzOutline Drawing 4 ip h c s - r e iv r d r O lat u d O NOtes: l & M Die Packaging Information [1] 1. all diMeNsiONs are iN iNches [MM]. 2. tYpical BONd pad is .004” sQuare. a standard alternate 3. BacKside MetalliZatiON: GOld. ic Gp-1 (Gel pack) [2] 4. BacKside Metal is GrOuNd. 5. BONd pad MetalliZatiON: GOld. t [1] Refer to the “Packaging Information” section for die 6. cONNectiON NOt reQuired FOr uNlaBeled BONd pads. p packaging dimensions. 7. Overall die siZe ±.002” [2] For alternate packaging information contact Hittite O Microwave Corporation. Info F rmoatri op n rfiurcne is ,h ed d ebly ivAe n r al y o g aDn evdic eto s i p s bla eli c evee d otro dbe e ras: cc uH ratite tiatne d M reli iac bl reo . w Ho av wev e er , Cno o For price, delivery, and to place orders: Analog Devices, Inc., responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rporation, 20 Alpha Road, Chelmsford, MA 01824 One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 978-250-3343 Fax: 978-250-3373 rights of third parties that may result from its use. Specifications subject to change without notice. No O P r h d o e ne r O : 7 n 81- -3li 2n 9 e - 4 a 7 t 0 ww 0 • O w rd .h e it r o tniltie n .c e ao t m license is granted by implication or otherwise under any patent or patent rights of Analog Devices. www.analog.com 4 - 4 Application Support: Pho Trademarks and registered trademarks are the property of their respective owners. ne: 978-250-33 A 4 p 3 p li coarti o ap n S p u s p @ po h rt itt : P ite ho . n c e o : 1m -800-ANALOG-D
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