Datasheet HMC441LP3E (Analog Devices) - 5

HMC441LP3E
v07.1017
GaAs pHEMT MMIC MEDIUM POWER AMPLIFIER, 6.5 - 13.5 GHz Absolute Maximum Ratings Typical Supply Current vs. Vdd
Drain Bias Voltage (Vdd) +6 Vdc Vdd (V) Idd (mA) T Gate Bias Voltage (Vgg1,Vgg2) -8 to 0 Vdc +5.5 92 M RF Input Power (RFIN)(Vdd = +5 Vdc) +15 dBm +5.0 90 Channel Temperature 175 °C +4.5 88 Continuous Pdiss (T = 85 °C) +3.3 83 0.76 W S - S (derate 8.5 mW/°C above 85 °C) +3.0 82 R Thermal Resistance 118.2 °C/W Note: Amplifier will operate over full voltage range shown above (channel to ground paddle) IE Storage Temperature -65 to +150 °C Operating Temperature -40 to +85 °C LIF ELECTROSTATIC SENSITIVE DEVICE ESD Sensitivity (HBM) Class0 Passed 100V P OBSERVE HANDLING PRECAUTIONS M
16-Lead Lead Frame Chip Scale Package [LFCSP] Outline Drawing 3 x 3 mm Body and 0.85 mm Package Height (HCP-16-1)
R A
Dimensions shown in millimeters
E
DETAIL A
W
(JEDEC 95) 3.10 0.30
O
3.00 SQ 0.25 PIN 1 2.90 0.20 INDICATOR PIN 1 INDICATOR AREA OPTIONS 0.50 13 16 (SEE DETAIL A) 12 1 BSC
R & P
EXPOSED 1.95 PAD
A
1.70 SQ 1.50
E
9 4 0.45 8 5 0.20 MIN
LIN
TOP VIEW BOTTOM VIEW 0.40 0.35 0.90 FOR PROPER CONNECTION OF 0.85 THE EXPOSED PAD, REFER TO 0.05 MAX THE PIN CONFIGURATION AND 0.80 0.02 NOM FUNCTION DESCRIPTIONS COPLANARITY SECTION OF THIS DATA SHEET. SEATING 0.08 PLANE 0.20 REF PKG-004863 COMPLIANT WITH JEDEC STANDARDS MO-220-VEED-4. 03-15-2017-B
16-Lead Lead Frame Chip Scale Package [LFCSP] 3 mm × 3 mm and 0.85 mm Package Height (HCP-16-1) Dimensions shown in millimeters
Package Information
Part Number Package Body Material Lead Finish MSL Rating Package Marking [2] HMC441LP3E RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn MSL1 [1] 441 XXXX [1] Max peak reflow temperature of 260 °C [2] 4-Digit lot number XXXX For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 781-329-4700 • Order online at www.analog.com
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Application Support: Phone: 1-800-ANALOG-D