link to page 4 link to page 4 HMC788A-EPEnhanced ProductABSOLUTE MAXIMUM RATINGS Table 2.THERMAL RESISTANCEParameterRating Thermal performance is directly linked to printed circuit board VCC 7 V (PCB) design and operating environment. Careful attention to RFIN (VCC = 5 V) 20 dBm PCB thermal design is required. Continuous Power Dissipation, P 1 DISS θJC is the junction to case thermal resistance. TCASE = 85°C 0.76 W TCASE = 105°C 0.59 W Table 3. Thermal Resistance Junction (TJ) Temperature 175°C Package TypeθJCUnit Operating (TOPR) Temperature Range −55°C to +105°C CP-6-101 118.0 °C/W Storage Temperature Range −65°C to +150°C 1 Thermal impedance simulated values are based on a JEDEC 2S2P thermal Electrostatic Discharge (ESD) Sensitivity, Class 1A test board with nine thermal vias. See JEDEC JESD51. Human Body Model (HBM) POWER DERATING CURVES 1 For maximum power dissipation vs. case temperature, see Figure 2. Figure 2 shows the maximum power dissipation vs. case Stresses at or above those listed under Absolute Maximum temperature. Ratings may cause permanent damage to the product. This is a 1.000 stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational 0.875W) section of this specification is not implied. Operation beyond (0.750 the maximum operating conditions for extended periods may TION PA affect product reliability. 0.625ISSI D 0.500ER W0.375M POMU 0.250XIMA 0.1250 020 –60–40–20020406080100120CASE TEMPERATURE (°C) 16213- Figure 2. Maximum Power Dissipation vs. Case Temperature ESD CAUTION Rev. B | Page 4 of 8 Document Outline Features Enhanced Product Features Applications Functional Block Diagram General Description Revision History Specifications Electrical Specifications Absolute Maximum Ratings Thermal Resistance Power Derating Curves ESD Caution Pin Configuration and Function Descriptions Interface Schematics Typical Performance Characteristics Outline Dimensions Ordering Guide
