Datasheet HMC788A-EP (Analog Devices) - 8

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HMC788A-EP Enhanced Product OUTLINE DIMENSIONS 1.50 1.40 2.05 1.30 DETAIL A 2.00 SQ 0.65 (JEDEC 95) BSC 1.95 5 8 PIN 1 INDEX 0.90 AREA EXPOSED 0.80 PAD 0.70 P IN 1 IN D IC AT O R AR E A OP T IO N S 0.40 4 1 (SEE DETAIL A) TOP VIEW 0.35 BOTTOM VIEW 0.30 1.30 REF 0.90 0.85 SIDE VIEW 0.05 MAX FOR PROPER CONNECTION OF 0.80 THE EXPOSED PAD, REFER TO 0.02 NOM THE PIN CONFIGURATION AND COPLANARITY FUNCTION DESCRIPTIONS 0.08 0.30 SECTION OF THIS DATA SHEET. C 005352 SEATING PLANE 0.25 0.203 REF 2018- -004900/ G 0.20 17- K P 08-
Figure 14. 6-Lead Lead Frame Chip Scale Package [LFCSP] 2 mm × 2 mm Body and 0.85 mm Package Height (CP-6-10) Dimensions shown in millimeters
ORDERING GUIDE Moisture Sensitivity Package Marking Model1 Temperature Range Level (MSL) Rating2 Package Description Option Code
HMC788ACPSZ-EP-PT −55°C to +105°C MSL3 6-Lead Lead Frame Chip Scale CP-6-10 Y6V Package [LFCSP] HMC788ACPSZ-EP-R7 −55°C to +105°C MSL3 6-Lead Lead Frame Chip Scale CP-6-10 Y6V Package [LFCSP] 1 Z = RoHS Compliant Part. 2 See the Absolute Maximum Ratings section.
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Rev. B | Page 8 of 8 Document Outline Features Enhanced Product Features Applications Functional Block Diagram General Description Revision History Specifications Electrical Specifications Absolute Maximum Ratings Thermal Resistance Power Derating Curves ESD Caution Pin Configuration and Function Descriptions Interface Schematics Typical Performance Characteristics Outline Dimensions Ordering Guide