Datasheet ADL5545 (Analog Devices) - 6

ADL5545 Data Sheet PIN CONFIGURATION AND FUNCTION DESCRIPTIONS RFIN 1 ADL5545 GND 2 TOP VIEW (2) GND (Not to Scale) RFOUT 3 NOTES 1. THE EXPOSED PAD ENCOMPASSES PIN 2 AND THE TAB AT THE TOP SIDE OF THE PACKAGE. SOLDER THE EXPOSED PAD TO A LOW IMPEDANCE GROUND
002
PLANE FOR ELECTRICAL GROUNDING AND THERMAL TRANSFER.
1385- 1 Figure 2. Pin Configuration
Table 4. Pin Function Descriptions Pin No. Mnemonic Description
1 RFIN RF Input. This pin requires a dc blocking capacitor. 2 GND Ground. Connect this pin to a low impedance ground plane. 3 RFOUT RF Output and Supply Voltage. DC bias is provided to this pin through an inductor that is connected to the external power supply. The RF path requires a dc blocking capacitor. EPAD Exposed Pad. The exposed pad encompasses Pin 2 and the tab at the top side of the package. Solder the exposed pad to a low impedance ground plane for electrical grounding and thermal transfer. Rev. B | Page 6 of 18 Document Outline FEATURES FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS 500 MHz TO 4 GHz FREQUENCY BAND 100 MHz TO 500 MHz FREQUENCY BAND 4 GHz TO 6 GHz FREQUENCY BAND GENERAL APPLICATIONS INFORMATION BASIC CONNECTIONS SOLDERING INFORMATION AND RECOMMENDED PCB LAND PATTERN OPERATION DOWN TO 30 MHz W-CDMA ACPR PERFORMANCE EVALUATION BOARD OUTLINE DIMENSIONS ORDERING GUIDE NOTES NOTES