ADH519S5.0 Burn-In Life Test, and Radiation 5.1. Burn-In Test Circuit, Life Test Circuit 5.1.1. The test conditions and circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 test condition D of MIL –STD-883. 5.1.2. HTRB is not applicable for this drawing. 5.2. Radiation Exposure Circuit 5.2.1. The radiation exposure circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing and acquiring activity upon request. Total dose irradiation testing shall be performed in accordance with MIL-STD-883 method 1019, condition A. 5.2.2. ADH519S have been characterized through all levels M, D, P, L, R of irradiation. However, ADH519S is only tested at the “R” level. Pre and Post irradiation values are identical unless otherwise specified in Table IA. 6.0 MIL-PRF-38535 QMLV Exceptions The manufacturing flow described in the RF & MICROWAVE STANDARD SPACE LEVEL PRODUCTS PROGRAM is to be considered a part of this specification. The brochure describes standard QMLV exceptions for Aerospace products run at the ADI Chelmsford, MA facility. 6.1. Wafer Fabrication Foundry information is available on request. 6.2. Group D Group D-5 Salt Atmosphere testing is not being performed.
