Datasheet HMC8412CHIPS (Analog Devices) - 4

HMC8412CHIPS Data Sheet ABSOLUTE MAXIMUM RATINGS Table 3. ELECTROSTATIC DISCHARGE (ESD) RATINGS Parameter Rating
The following ESD information is provided for handling of VDD 7 V ESD-sensitive devices in an ESD protected area only. RF Input Power 25 dBm Human body model (HBM) per ANSI/ESDA/JEDDEC JS-001. Continuous Power Dissipation (PDISS), TA = 85°C 1.1 W (Derate 12.2 mW/°C Above 85°C)
ESD Ratings for HMC8412CHIPS
Temperature Channel 175°C
Table 5. HMC8412CHIPS, 4-Pad Die
Storage Range −65°C to +150°C
ESD Model Withstand Threshold (V) Class
Operating Range −55°C to +85°C HBM ±500 1B Junction Temperature to Maintain 1,000,000 175°C
ESD CAUTION
Hour Mean Time to Failure (MTTF) Nominal Junction Temperature (TA = 85°C, 113.4°C VDD = 5 V, IDQ = 60 mA) Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability.
THERMAL RESISTANCE
Thermal performance is directly linked to system design and operating environment. Careful attention to the printed circuit board (PCB) thermal design is required. θJC is the junction-to-case thermal resistance, channel to bottom of die using die attach epoxy.
Table 4. Thermal Resistance Package Type θJC Unit
C-4-5 94.6 °C/W Rev. 0 | Page 4 of 21 Document Outline Features Applications Functional Block Diagram General Description Revision History Specifications 0.4 GHz to 8 GHz Frequency Range 8 GHz to 10 GHz Frequency Range Absolute Maximum Ratings Thermal Resistance Electrostatic Discharge (ESD) Ratings ESD Ratings for HMC8412CHIPS ESD Caution Pin Configuration and Function Descriptions Interface Schematics Typical Performance Characteristics Small Signal Response Large Signal Response Theory of Operation Applications Information Typical Application Circuit Recommended Bias Sequencing During Power-Up During Power-Down Assembly Diagram Mounting and Bonding Techniques for Millimeter Wave GaAs MMICs Handling Precautions Outline Dimensions Ordering Guide