Datasheet HMC8412CHIPS (Analog Devices) - 10

HMC8412CHIPS Data Sheet 4.0 4.0 18kΩ, IDQ = 20mA 18kΩ, IDQ = 20mA 3.5 3.5kΩ, IDQ = 40mA 3.5 3.5kΩ, I 1.43kΩ, I DQ = 40mA DQ = 60mA 1.43kΩ, I 604Ω, I DQ = 60mA DQ = 80mA 604Ω, IDQ = 80mA 3.0 3.0 ) ) dB dB ( 2.5 ( 2.5 E E R R 2.0 2.0 FIGU FIGU E E 1.5 1.5 OIS OIS N N 1.0 1.0 0.5 0.5 0 0 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
031
0 1 2 3 4 5 6 7 8 9 10 11
034
FREQUENCY (GHz)
24012-
FREQUENCY (GHz)
24012- Figure 31. Noise Figure vs. Frequency for Various Supply Currents, 200 MHz Figure 34. Noise Figure vs. Frequency for Various Supply Currents, VDD = 5 V to 1 GHz, VDD = 5 V
0 0 +85°C +85°C +25°C –5 +25°C –55°C –55°C –5 ) ) B B –10 (d (d N N IO IO T –10 –15 T A A L L SO SO –20 SE I –15 SE I –25 EVER EVER R R –20 –30 –35 –25 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
032
0 1 2 3 4 5 6 7 8 9 10 11
035
FREQUENCY (GHz)
24012-
FREQUENCY (GHz)
24012- Figure 32. Reverse Isolation vs. Frequency for Various Temperatures, Figure 35. Reverse Isolation vs. Frequency for Various Temperatures, 200 MHz to 1 GHz, VDD = 5 V, IDQ = 60 mA VDD = 5 V, IDQ = 60 mA
0 0 7V 7V 6V –5 6V 5V 5V –5 4V ) ) 3V B 4V B –10 3V (d (d N N IO IO T –10 –15 T A A L L SO SO –20 SE I –15 SE I –25 EVER EVER R R –20 –30 –35 –25 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
033
0 1 2 3 4 5 6 7 8 9 10 11
036
FREQUENCY (GHz)
24012-
FREQUENCY (GHz)
24012- Figure 33. Reverse Isolation vs. Frequency for Various Supply Voltages, Figure 36. Reverse Isolation vs. Frequency for Various Supply Voltages, 200 MHz to 1 GHz, IDQ = 60 mA IDQ = 60 mA Rev. 0 | Page 10 of 21 Document Outline Features Applications Functional Block Diagram General Description Revision History Specifications 0.4 GHz to 8 GHz Frequency Range 8 GHz to 10 GHz Frequency Range Absolute Maximum Ratings Thermal Resistance Electrostatic Discharge (ESD) Ratings ESD Ratings for HMC8412CHIPS ESD Caution Pin Configuration and Function Descriptions Interface Schematics Typical Performance Characteristics Small Signal Response Large Signal Response Theory of Operation Applications Information Typical Application Circuit Recommended Bias Sequencing During Power-Up During Power-Down Assembly Diagram Mounting and Bonding Techniques for Millimeter Wave GaAs MMICs Handling Precautions Outline Dimensions Ordering Guide