link to page 6 link to page 6 link to page 23 Data SheetHMC8411LP2FEABSOLUTE MAXIMUM RATINGSTHERMAL RESISTANCETable 4. Parameter1Rating Thermal performance is directly linked to printed circuit board Drain Bias Voltage (V (PCB) design and operating environment. Close attention to DD) 7 V Radio Frequency Input (RF PCB thermal design is required. IN) Power 20 dBm Channel Temperature 175°C θJC is the junction to case thermal resistance. Continuous Power Dissipation (PDISS), T = 85°C 1.098 W (Derate 12.2 mW/°C Above 85°C) Table 5. Thermal Resistance Storage Temperature Range −65°C to +150°C Package TypeθJCUnit Operating Temperature Range −40°C to +85°C CP-6-12 82 °C/W Peak Reflow Temperature Moisture 260°C Sensitivity Level 1 (MSL1)2 Electrostatic Discharge (ESD) Sensitivity ESD CAUTION Human Body Model (HBM) 500 V, Class 1B passed 1 When referring to a single function of a multifunction pin in the parameters, only the portion of the pin name that is relevant to the specification is listed. For full pin names of multifunction pins, refer to the Pin Configuration and Function Descriptions section. 2 See the Ordering Guide section for more information. Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. B | Page 5 of 23 Document Outline Features Applications Functional Block Diagram General Description Revision History Specifications 0.01 GHz to 1 GHz Frequency Range 1 GHz to 6 GHz Frequency Range 6 GHz to 10 GHz Frequency Range Absolute Maximum Ratings Thermal Resistance ESD Caution Pin Configuration and Function Descriptions Interface Schematics Typical Performance Characteristics Theory of Operation Applications Information Recommended Bias Sequencing During Power-Up During Power-Down Typical Application Circuit Evaluation Board Outline Dimensions Ordering Guide
