Datasheet HMC8325 (Analog Devices) - 4

HMC8325 Data Sheet ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE Table 2. Parameter Rating
Thermal performance is directly linked to printed circuit board Drain Bias Voltage (V to V ) 4.5 V (PCB) design and operating environment. Careful attention to D1 D4 Gate Bias Voltage (V to V ) −3 V to 0 V PCB thermal design is required. G1 G4 Maximum Junction Temperature (to 175°C
Table 3. Thermal Resistance
Maintain 1 Million Hours Mean Time to
1
Failure (MTTF))
Package Type θ Unit JC
Storage Temperature Range −65°C to +150°C C-22-12 225 °C/W Operating Temperature Range −55°C to +85°C 1 Based on ABLEBOND® 84-1LMIT as die attach epoxy. 2 Test Condition: Thermal impedance simulated values are based on ESD Sensitivity, Human Body Model (HBM) Class 0 (150 V) JEDEC 2S2P thermal test board with four thermal vias. See JEDEC JESD51. Stresses at or above those listed under Absolute Maximum
ESD CAUTION
Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. 0 | Page 4 of 16 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATION INFORMATION MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GAAS MMICS HANDLING PRECAUTIONS Storage Cleanliness Static Sensitivity Transients General Handling MOUNTING Eutectic Die Attach Epoxy Die Attach WIRE BONDING ASSEMBLY DIAGRAM OUTLINE DIMENSIONS ORDERING GUIDE