Datasheet HMC8325 (Analog Devices) - 8

HMC8325 Data Sheet 0 0 –5 –5 –10 B) –10 B) d d ( ( S S S –15 S –15 O O –20 –20 URN L URN L T T RE –25 RE –25 UT UT INP –30 INP –30 TA = +85°C TA = +85°C –35 TA = +25°C –35 TA = +25°C TA = –55°C TA = –55°C –40 –40 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86
020
71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86
023
FREQUENCY (GHz)
14692-
FREQUENCY (GHz)
14692- Figure 20. Input Return Loss vs. Frequency over Temperature, Figure 23. Input Return Loss vs. Frequency over Temperature, VDx = 3 V, IDx = 57 mA VDx = 4 V, IDx = 57 mA
0 0 –2 T –2 A = +85°C TA = +85°C –4 TA = +25°C –4 TA = +25°C TA = –55°C –6 TA = –55°C –6 B) B) d –8 d –8 ( ( S S S –10 S –10 O O –12 –12 –14 –14 URN L URN L T –16 T –16 RE –18 RE –18 UT –20 UT –20 P P UT –22 UT –22 O O –24 –24 –26 –26 –28 –28 –30 –30 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86
021
71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86
024
FREQUENCY (GHz)
14692-
FREQUENCY (GHz)
14692- Figure 21. Output Return Loss vs. Frequency over Temperature, Figure 24. Output Return Loss vs. Frequency over Temperature, VDx = 3 V, IDx = 57 mA VDx = 4 V, IDx = 57 mA
10 10 ID3/ID4 = 1.5mA ID3/ID4 = 15.0mA T 9 A = +85°C 9 ID3/ID4 = 3.0mA ID3/ID4 = 20.0mA TA = +25°C ID3/ID4 = 5.0mA ID3/ID4 = 25.0mA T I I A = –55°C 8 8 D3/ID4 = 10.0mA D3/ID4 = 30.0mA ) 7 ) 7 dB dB ( ( E 6 E 6 R R 5 5 FIGU FIGU E E 4 4 OIS OIS N 3 N 3 2 2 1 1 0 0 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86
022
71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86
025
FREQUENCY (GHz)
14692-
FREQUENCY (GHz)
14692- Figure 22. Noise Figure vs. Frequency over Temperature, Figure 25. Noise Figure vs. Frequency over Drain Current, VDx = 3 V, VDx = 4 V, IDx = 50 mA VG1 and VG2 Fixed at 20 mA, VG3 and VG4 Swept Rev. 0 | Page 8 of 16 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATION INFORMATION MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GAAS MMICS HANDLING PRECAUTIONS Storage Cleanliness Static Sensitivity Transients General Handling MOUNTING Eutectic Die Attach Epoxy Die Attach WIRE BONDING ASSEMBLY DIAGRAM OUTLINE DIMENSIONS ORDERING GUIDE