Data SheetADL7003ABSOLUTE MAXIMUM RATINGS Table 4.THERMAL RESISTANCEParameterRating θJA is specified for the worst-case conditions, that is, a device Drain Bias Voltage (VDD) 4.5 V soldered in a circuit board for surface-mount packages. Gate Bias Voltage (VGG) −2 V to 0 V dc Radio Frequency (RF) Input Power (RFIN) 15 dBm Table 5. Thermal Resistance Continuous Power Dissipation (PDISS), 1.350 W Package TypeθJCUnit at TDIE BOTTOM = 85°C (Derate 15.00 mW/°C C-14-5 66.70 °C/W Above 85°C) Storage Temperature Range (Ambient) −65°C to +150°C ESD CAUTION Operating Temperature Range (Die Bottom) −55°C to +85°C ESD Sensitivity Class 1A 250 V Human Body Model (HBM) Channel Temperature to Maintain 175°C 1 Million Hour MTTF Nominal Channel Temperature at 110°C TDIE BOTTOM = 85°C, VDD = 3 V Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. 0 | Page 5 of 18 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS 50 GHz TO 70 GHz FREQUENCY RANGE 70 GHz TO 90 GHz FREQUENCY RANGE 90 GHz TO 95 GHz FREQUENCY RANGE ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATIC TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICS Handling Precautions Mounting Wire Bonding TYPICAL APPLICATION CIRCUIT ASSEMBLY DIAGRAM OUTLINE DIMENSIONS ORDERING GUIDE
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