Datasheet HMC8401 (Analog Devices) - 7
Производитель | Analog Devices |
Описание | DC to 28 GHz, GaAs pHEMT MMIC Low Noise Amplifier |
Страниц / Страница | 17 / 7 — Data Sheet. HMC8401. INTERFACE SCHEMATICS. RFOUT. RFIN. VGG2. GG1. VDD. … |
Версия | B |
Формат / Размер файла | PDF / 363 Кб |
Язык документа | английский |
Data Sheet. HMC8401. INTERFACE SCHEMATICS. RFOUT. RFIN. VGG2. GG1. VDD. GND. ACG

15 предложений от 12 поставщиков Усилитель IC и модуль RF, RF Amp Chip Single GP 28GHz 8.5V 8Pin Bare Die Tray |
| HMC8401 Analog Devices | 20 041 ₽ | |
| HMC8401 Analog Devices | 39 158 ₽ | |
| HMC8401 Analog Devices | 40 854 ₽ | |
| HMC8401-SX Analog Devices | по запросу | |
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Текстовая версия документа
Data Sheet HMC8401 INTERFACE SCHEMATICS RFOUT RFIN
003 007 13850- 13850- Figure 3. RFIN Interface Schematic Figure 7. RFOUT Interface Schematic
VGG2 V
004
GG1
008 13850- 13850- Figure 4. VGG2 Interface Schematic Figure 8. VGG1 Interface Schematic
VDD GND
009 13850- 005 Figure 9. GND Interface Schematic 13850- Figure 5. VDD Interface Schematic
ACG
006 13850- Figure 6. ACG Interface Schematic Rev. B | Page 7 of 17 Document Outline Features Applications General Description Functional Block Diagram Table of Contents Revision History Specifications 0.01 GHz to 3 GHz Frequency Range 3 GHz to 26 GHz Frequency Range 26 GHz to 28 GHz Frequency Range Absolute Maximum Ratings ESD Caution Pin Configuration and Function Descriptions Interface Schematics Typical Performance Characteristics Theory of Operation Applications Information Biasing Procedures Mounting and Bonding Techniques for Millimeterwave GaAs MMICs Handling Precautions Mounting Eutectic Die Attach Epoxy Die Attach Wire Bonding Typical Application Circuit Assembly Diagram Outline Dimensions Ordering Guide